FDC6302P Rev.C

Figure 10. Single Pulse Maximum Power

Dissipation.

0.1

0.3

1

2

5

10

15

25

1

2

3

5

10

15

25

-V

, DRAIN TO SOURCE VOLTAGE (V)

DS

C iss

f = 1 MHz

V

= 0 V

GS

Coss

Crss

Figure 8. Capacitance Characteristics.

Figure 7. Gate Charge Characteristics.

Figure 9. Maximum Safe Operating Area.

Typical Electrical And Thermal Characteristics

0

0.1

0.2

0.3

0.4

0.5

0

2

4

6

8

Q

, GATE CHARGE (nC)

g

V

= -5V

DS

-10

-15

I

= -0.2A

D

1

2

5

10

20

40

0.01

0.02

0.05

0.1

0.2

0.5

0.8

- V

, DRAIN-SOURCE VOLTAGE (V)

RDS(ON)

LIMIT

DC

DS

1s

100ms

10ms

V

= -2.7V

SINGLE PULSE

R

=See Note 1b

T = 25°C

GS

A

θJA

1ms

0.01

0.1

1

10

100

300

0

1

2

3

4

5

SINGLE PULSE TIME (SEC)

SINGLE PULSE

R

=See note 1b

T = 25°C

θJA

A

0.0001

0.001

0.01

0.1

1

10

100

300

0.01

0.02

0.05

0.1

0.2

0.5

1

t , TIME (sec)

1

Single Pulse

D = 0.5

0.1

0.05

0.02

0.01

0.2

Duty Cycle, D = t / t

1

2

R

(t) = r(t) * R

R

= See Note 1b

θJA

θJA

θJA

T - T

= P * R

(t)

A

J

P(pk)

Figure 11. Transient Thermal Response Curve

.

Note: Thermal characterization performed using the conditions described in note 1b.Transient thermal

response will change depending on the circuit board design.