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TPS54335 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS54335 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 37 page TPS54335 TPS54336 1 2 3 4 5 6 7 8 BOOT VIN PH GND RT EN COMP VSENSE PowerPAD (9) 1 2 3 4 5 6 7 8 BOOT VIN PH GND SS EN COMP VSENSE PowerPAD (9) TPS54335 TPS54336 SLVSC03 – MAY 2013 www.ti.com ELECTRICAL CHARACTERISTICS (continued) The Electrical Ratings specified in this section will apply to all specifications in this document unless otherwise noted. These specifications will be interpreted as conditions that will not degrade the device’s parametric or functional specifications for the life of the product containing it. TJ = –40°C to +150°C, VIN =4.5 TO 28V, (unless otherwise noted) PARAMETERS CONDITIONS MIN TYP MAX UNIT SWITCHING FREQUENCY TPS54335 50 1500 kHz TPS54335, Rrt = 100 k Ω 384 480 576 kHz Switching frequency range TPS54335, Rrt = 1000 k Ω, –40°C~105°C 40 50 60 kHz TPS54335, Rrt = 30 k Ω 1200 1500 1800 kHz Internal switching frequency TPS54336 272 340 408 kHz SLOW START Internal slow start time TPS54335 2 ms Slow start charge current TPS54336 2.3 µA PIN ASSIGNMENTS 8-PIN SOIC WITH THERMAL PAD (TOP VIEW) PIN FUNCTIONS PIN DESCRIPTION NAME NUMBER A bootstrap capacitor is required between BOOT and PH. If the voltage on this capacitor is below the BOOT 1 minimum required by the output device, the output is forced to switch off until the capacitor is refreshed. Vin 2 Input supply voltage, 4.5 V to 28 V. PH 3 The source of the internal high side power MOSFET. GND 4 Ground. VSENSE 5 Inverting node of the gm error amplifier. Error amplifier output, and input to the output switch current comparator. Connect frequency COMP 6 compensation components to this pin. EN 7 Enable pin. Float to enable. RT (TPS54335) 8 Connect to an external timing resistor to adjust the switching frequency of the device. Slow-start and tracking. An external capacitor connected to this pin sets the internal voltage reference SS (TPS54336) 8 rise time. The voltage on this pin overrides the internal reference. GND pin should be connected to the exposed thermal pad for proper operation. This thermal pad Powerpad 9 should be connected to any internal PCB ground plane using multiple vias for good thermal performance. 4 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: TPS54335 TPS54336 |
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