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ADG726BSU Datasheet(PDF) 6 Page - Analog Devices

No. de pieza ADG726BSU
Descripción Electrónicos  16-/32-Channel, 4  1.8 V to 5.5 V, 2.5 V Analog Multiplexers
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Fabricante Electrónico  AD [Analog Devices]
Página de inicio  http://www.analog.com
Logo AD - Analog Devices

ADG726BSU Datasheet(HTML) 6 Page - Analog Devices

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REV. 0
–6–
ADG726/ADG732
PIN CONFIGURATIONS
LFCSP and TQFP
PIN 1
INDICATOR
TOP VIEW
ADG732
S12
S11
S10
S9
S8
S7
S6
S5
S4
S3
S2
S1
NC = NO CONNECT
36 S28
35 S27
34 S26
33 S25
32 S24
31 S23
30 S22
29 S21
28 S20
27 S19
26 S18
25 S17
1
2
3
4
5
6
7
8
9
10
11
12
PIN 1
INDICATOR
TOP VIEW
ADG726
1
S12A
2
S11A
3
S10A
4
S9A
5
S8A
6
S7A
7
S6A
8
S5A
9
S4A
10
S3A
11
S2A
12
S1A
NC = NO CONNECT
36 S12B
35 S11B
34 S10B
33 S9B
32 S8B
31 S7B
30 S6B
29 S5B
28 S4B
27 S3B
26 S2B
25 S1B
ABSOLUTE MAXIMUM RATINGS
1
(TA = 25
°C, unless otherwise noted.)
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –7 V
Analog Inputs
2 . . . . . . . . . . . . . . V
SS – 0.3 V to VDD + 0.3 V or
30 mA, Whichever Occurs First
Digital Inputs
2 . . . . . . . . . . . . . . . . . . –0.3 V to V
DD + 0.3 V or
30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 mA
(Pulsed at 1 ms, 10% Duty Cycle Max)
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40
°C to +85°C
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG726/ADG732 features proprietary ESD protection circuitry, permanent damage
may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150
°C
Thermal Impedence (Four-layer board)
48-Lead LFCSP . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 C/W
48-Lead TQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . 54.6 C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . . 300
°C
IR Reflow, Peak Temperature (<20 sec) . . . . . . . . . . . . 235
°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only and functional operation of
the device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2Overvoltages at A,
EN, WR, CS, S, or D will be clamped by internal diodes.
Current should be limited to the maximum ratings given.
WARNING!
ESD SENSITIVE DEVICE
ORDERING GUIDE
Model
Temperature Range Package Description
Package Option
ADG726BCP
–40
°C to +85°CChip Scale Package (LPCSP) CP-48
ADG726BSU
–40
°C to +85°CThin Quad Flatpack (TQFP)
SU-48
ADG732BCP
–40
°C to +85°CChip Scale Package (LPCSP) CP-48
ADG732BSU
–40
°C to +85°CThin Quad Flatpack (TQFP)
SU-48


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