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DAC7545GLU Datasheet(PDF) 7 Page - Burr-Brown (TI)

[Old version datasheet] Texas Instruments acquired Burr-Brown Corporation.
No. de pieza DAC7545GLU
Descripción Electrónicos  CMOS 12-Bit Multiplying DIGITAL-TO-ANALOG CONVERTER Microprocessor Compatible
Download  12 Pages
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Fabricante Electrónico  BURR-BROWN [Burr-Brown (TI)]
Página de inicio  http://www.burr-brown.com
Logo BURR-BROWN - Burr-Brown (TI)

DAC7545GLU Datasheet(HTML) 7 Page - Burr-Brown (TI)

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PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
Op Temp (°C)
Top-Side Markings
(4)
Samples
DAC7545GLP
OBSOLETE
ZZ (BB)
ZZ222
20
TBD
Call TI
Call TI
-40 to 85
DAC7545GLU
NRND
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
DAC7545GLU
DAC7545GLUG4
NRND
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
DAC7545GLU
DAC7545JP
OBSOLETE
ZZ (BB)
ZZ222
20
TBD
Call TI
Call TI
-40 to 85
DAC7545JU
NRND
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
DAC7545JU
DAC7545JUG4
NRND
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
DAC7545JU
DAC7545KP
OBSOLETE
ZZ (BB)
ZZ222
20
TBD
Call TI
Call TI
-40 to 85
DAC7545KU
NRND
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
DAC7545KU
DAC7545KUG4
NRND
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
DAC7545KU
DAC7545LP
OBSOLETE
ZZ (BB)
ZZ222
20
TBD
Call TI
Call TI
-40 to 85
DAC7545LU
NRND
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
DAC7545LU
DAC7545LUG4
NRND
SOIC
DW
20
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
DAC7545LU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.


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