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LM3886TF Datasheet(PDF) 2 Page - Texas Instruments |
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LM3886TF Datasheet(HTML) 2 Page - Texas Instruments |
2 / 31 page LM3886 SNAS091C – MAY 1999 – REVISED MARCH 2013 www.ti.com Typical Application *Optional components dependent upon specific design requirements. Refer to External Components Description for a component functional description. Figure 1. Typical Audio Amplifier Application Circuit Connection Diagram Top View Preliminary: call your local Texas Instruments Sales Rep. or distributor for availability Figure 2. TO-220 and PFM Plastic Packages See Package Number NDJ0011B for Staggered Lead Non-Isolated Package or NDA0011B for Staggered Lead Isolated Package(1) (1) The LM3886T package TA11B is a non-isolated package, setting the tab of the device and the heat sink at V− potential when the LM3886 is directly mounted to the heat sink using only thermal compound. If a mica washer is used in addition to thermal compound, θCS (case to sink) is increased, but the heat sink will be isolated from V −. 2 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM3886 |
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