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TPS75915KTTR Datasheet(PDF) 17 Page - Texas Instruments |
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TPS75915KTTR Datasheet(HTML) 17 Page - Texas Instruments |
17 / 30 page www.ti.com 1 10 0 10 20 RθSA − Heatsink Thermal Resistance − °C/W No Heatsink TA = 55°C Natural Convection Air Flow = 150 LFM Air Flow = 250 LFM Air Flow = 500 LFM P Dmax + (3.3 – 2.5) V x 3 A + 2.4 W (7) RθJAmax + (125 – 55) °C 2.4 W + 29 °C W (8) TPS75901, TPS75915 TPS75918, TPS75925, TPS75933 SLVS318E – DECEMBER 2000 – REVISED MARCH 2004 THERMAL INFORMATION (continued) Figure 24. Power Dissipation vs Heatsink Thermal Resistance The TO-263 package provides an effective means of managing power dissipation in surface mount applications. The TO-263 package dimensions are provided in the Mechanical Data section at the end of the data sheet. The addition of a copper plane directly underneath the TO-263 package enhances the thermal performance of the package. To illustrate, the TPS75925 in a TO-263 package was chosen. For this example, the average input voltage is 3.3V, the output voltage is 2.5 V, the average output current is 3 A, the ambient temperature 55 °C, the air flow is 150 LFM, and the operating environment is the same as documented below. Neglecting the quiescent current, the maximum average power is: Substituting TJmax for TJ into Equation 4 gives Equation 8: From Figure 25, RΘJA vs Copper Heatsink Area, the ground plane needs to be 2 cm 2 for the part to dissipate 2.4W. The model operating environment used in the computer model to construct Figure 25 consisted of a standard JEDEC High-K board (2S2P) with a 1 oz. internal copper plane and ground plane. The package is soldered to a 2 oz. copper pad. The pad is tied through thermal vias to the 1 oz. ground plane. Figure 26 shows the side view of the operating environment used in the computer model. 17 |
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