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FCPF7N60NT Datasheet(PDF) 1 Page - Fairchild Semiconductor |
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FCPF7N60NT Datasheet(HTML) 1 Page - Fairchild Semiconductor |
1 / 10 page ©2009 Fairchild Semiconductor Corporation FCP7N60N / FCPF7N60NT Rev. C0 www.fairchildsemi.com 1 March 2013 FCP7N60N / FCPF7N60NT N-Channel SupreMOS® MOSFET 600 V, 6.8 A, 520 m Ω Features •RDS(on) = 460 mΩ (Typ.) @ VGS = 10 V, ID = 3.4 A • Ultra Low Gate Charge (Typ.Qg = 17.8 nC) • Low Effective Output Capacitance (Typ. Coss.eff = 91 pF) • 100% Avalanche Tested • RoHS Compliant Application • LCD/LED TV and Monitor • Lighting • Solar Inverter • AC-DC Power Supply Description The SupreMOS® MOSFET is Fairchild Semiconductor®’s next generation of high voltage super-junction (SJ) technology employing a deep trench filling process that differentiates it from the conventional SJ MOSFETs. This advanced technology and precise process control provides lowest Rsp on-resistance, superior switching performance and ruggedness. SupreMOS MOSFET is suitable for high frequency switching power converter applications such as PFC, server/telecom power, FPD TV power, ATX power and industrial power applications. D G S TO-220F G S D TO-220 G D S MOSFET Maximum Ratings T C = 25 oC unless otherwise noted Thermal Characteristics Symbol Parameter FCP7N60N FCPF7N60NT Unit VDSS Drain to Source Voltage 600 V VGSS Gate to Source Voltage ±30 V ID Drain Current -Continuous (TC = 25 oC) 6.8 6.8* A -Continuous (TC = 100 oC) 4.3 4.3* IDM Drain Current - Pulsed (Note 1) 20.4 20.4 A EAS Single Pulsed Avalanche Energy (Note 2) 79.4 mJ IAR Avalanche Current 6.8 A EAR Repetitive Avalanche Energy 0.6 mJ dv/dt MOSFET dv/dt Ruggedness 100 V/ns Peak Diode Recovery dv/dt (Note 3) 4.9 V/ns PD Power Dissipation (TC = 25 oC) 64.1 30.5 W - Derate above 25oC 0.51 0.24 W/oC TJ, TSTG Operating and Storage Temperature Range -55 to +150 oC TL Maximum Lead Temperature for Soldering Purpose, 1/8” from Case for 5 Seconds 300 oC Symbol Parameter FCP7N60N FCPF7N60NT Unit RθJC Thermal Resistance, Junction to Case 1.95 4.1 oC/W RθCS Thermal Resistance, Case to Heak Sink ( Typical) 0.5 0.5 RθJA Thermal Resistance, Junction to Ambient 62.5 62.5 *Drain current limited by maximum junction temperature |
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