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HCPL-181-000E Datasheet(PDF) 3 Page - AVAGO TECHNOLOGIES LIMITED |
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HCPL-181-000E Datasheet(HTML) 3 Page - AVAGO TECHNOLOGIES LIMITED |
3 / 6 page 3 Package Outline Drawings HCPL-181-000E HCPL-181-060E Solder Reflow Temperature Profile 1. One-time soldering reflow is recommended within the condition of temperature and time profile shown at right. 2. When using another soldering method such as infrared ray lamp, the temperature may rise partially in the mold of the device. Keep the temperature on the package of the device within the condition of (1) above. Note: Non-halide flux should be used. 30 seconds 60 sec 150° C 90 sec 60 sec 60 ~ 150 sec Time (sec) 200° C 217° C 250° C 260° C (Peak Temperature) 25° C DIMENSIONS IN MILLIMETERS. 7.00 181 YW W 2.54 ±0.25 DATE CODE + 0.2 – 0.7 3.70 ± 0.45 RANK LEAD FREE 5.30 ± 0.3 0.40 ± 0.1 2.00 ± 0.2 0.10 ± 0.1 0.2 ± 0.05 4.40 ± 0.2 DIMENSIONS IN MILLIMETERS. 3.70 ± 0.45 7.00 181 V YW W 2.54 ±0.25 DATE CODE RANK LEAD FREE + 0.2 – 0.7 5.30 ± 0.3 0.40 ± 0.1 2.00 ± 0.2 0.10 ± 0.1 0.2 ± 0.05 4.40 ± 0.2 |
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