AMC1200

AMC1200B

SBAS542B – APRIL 2011 – REVISED AUGUST 2012

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE/ORDERING INFORMATION

For the most current package and ordering information see the Package Option Addendum at the end of this

document, or visit the device product folder on www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over the operating ambient temperature range, unless otherwise noted.

AMC1200, AMC1200B

UNIT

Supply voltage, VDD1 to GND1 or VDD2 to GND2

–0.5 to 6

V

Analog input voltage at VINP, VINN

GND1 – 0.5 to VDD1 + 0.5

V

Input current to any pin except supply pins

±10

mA

+150

°C

Human body model (HBM)

JEDEC standard 22, test method

±2500

V

A114-C.01

Electrostatic discharge (ESD) ratings,

all pins

Charged device model (CDM)

JEDEC standard 22, test method

±1000

V

C101

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute

maximum rated conditions for extended periods may affect device reliability.

THERMAL INFORMATION

AMC1200,

AMC1200B

UNITS

DUB (SOP)

8 PINS

Junction-to-ambient thermal resistance

75.1

Junction-to-case (top) thermal resistance

61.6

Junction-to-board thermal resistance

39.8

°C/W

Junction-to-top characterization parameter

27.2

Junction-to-board characterization parameter

39.4

Junction-to-case (bottom) thermal resistance

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

REGULATORY INFORMATION

VDE/IEC

UL

Certified according to IEC 60747-5-2

Recognized under 1577 component recognition program

File number: 40016131

File number: E181974

2

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