A

B

C

A

B

C

1

2

1

2

LAZER MARKING

VIEW

BUMP VIEW

TPS22963

TPS22964

SLVSBS6 – JUNE 2013

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

For the most current package and ordering information, see the Package Option Addendum at the end of this

document, or see the TI web site at www.ti.com

DEVICE INFORMATION

YZP PACKAGE

Terminals Assignments (YZP Package)

C

GND

ON

B

VOUT

VIN

A

VOUT

VIN

1

2

PIN DESCRIPTIONS

TPS22963/64

PIN NAME

DESCRIPTION

C1

GND

Ground

C2

ON

Switch control input, active high. Do not leave floating

A1, B1

VOUT

Switch output

A2, B2

VIN

Switch input. Use a bypass capacitor to ground (ceramic)

2

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