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LM2937ES-12 Datasheet(PDF) 11 Page - Texas Instruments

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No. de pieza LM2937ES-12
Descripción Electrónicos  LM2937 500 mA Low Dropout Regulator
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
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LM2937ES-12 Datasheet(HTML) 11 Page - Texas Instruments

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SNVS100E – MARCH 2000 – REVISED APRIL 2013
HEATSINKING TO-220 PACKAGE PARTS
The TO-220 can be attached to a typical heatsink, or secured to a copper plane on a PC board. If a copper plane
is to be used, the values of
θ(J−A) will be the same as shown in the next section for the DDPAK/TO-263.
If a manufactured heatsink is to be selected, the value of heatsink-to-ambient thermal resistance,
θ(H−A), must
first be calculated:
θ(H−A) = θ(J−A) − θ(C−H) − θ(J−C)
where
θ(J−C) is defined as the thermal resistance from the junction to the surface of the case. A value of 3°C/W can be
assumed for
θ(J−C) for this calculation
θ(C−H) is defined as the thermal resistance between the case and the surface of the heatsink. The value of
θ(C−H) will vary from about 1.5°C/W to about 2.5°C/W (depending on method of attachment, insulator, etc.). If
the exact value is unknown, 2°C/W should be assumed for
θ(C−H)
(3)
When a value for
θ(H−A) is found using the equation shown, a heatsink must be selected that has a value that is
less than or equal to this number.
θ(H−A) is specified numerically by the heatsink manufacturer in the catalog, or shown in a curve that plots
temperature rise vs power dissipation for the heatsink.
HEATSINKING DDPAK/TO-263 AND SOT-223 PACKAGE PARTS
Both the DDPAK/TO-263 (“S”) and SOT-223 (“MP”) packages use a copper plane on the PCB and the PCB itself
as a heatsink. To optimize the heat sinking ability of the plane and PCB, solder the tab of the package to the
plane.
Figure 26 shows for the DDPAK/TO-263 the measured values of
θ(J−A) for different copper area sizes using a
typical PCB with 1 ounce copper and no solder mask over the copper area used for heatsinking.
Figure 26.
θ(J−A) vs. Copper (1 ounce) Area for the DDPAK/TO-263 Package
As shown in the figure, increasing the copper area beyond 1 square inch produces very little improvement. It
should also be observed that the minimum value of
θ(J−A) for the DDPAK/TO-263 package mounted to a PCB is
32°C/W.
As a design aid, Figure 27 shows the maximum allowable power dissipation compared to ambient temperature
for the DDPAK/TO-263 device (assuming
θ(J−A) is 35°C/W and the maximum junction temperature is 125°C).
Copyright © 2000–2013, Texas Instruments Incorporated
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