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BD12KA5WFP-E2 Datasheet(PDF) 9 Page - Rohm

No. de pieza BD12KA5WFP-E2
Descripción Electrónicos  low-saturation regulators that are available for output currents up to 500mA.
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Fabricante Electrónico  ROHM [Rohm]
Página de inicio  http://www.rohm.com
Logo ROHM - Rohm

BD12KA5WFP-E2 Datasheet(HTML) 9 Page - Rohm

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BDxxKA5 Series
BDxxKA5W Series
BD00KA5W Series
TSZ02201-0R6R0A600150-1-2
© 2012 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ22111・15・001
26.Jun.2012 Rev.001
●I/O equivalence circuit
●Power Dissipation
When using at temperatures over Ta=25℃, please refer to the power dissipation shown in Fig.20 through 22.
The IC characteristics are closely related to the temperature at which the IC is used, so if the temperature exceeds the
maximum junction temperature TjMAX, the device may malfunction or be destroyed. The heat of the IC requires sufficient
consideration regarding instantaneous destruction and long-term operation reliability. In order to protect the IC from thermal
damage, it is necessary to operate it at temperatures less than the maximum junction temperature TjMAX.
Even when the ambient temperature Ta is a normal temperature (25℃), the chip(junction) temperature Tj may be quite high,
so please operate the IC at temperatures less than the acceptable loss Pd.
With BD00KA5WFP/WF,R1and R2 are connected
outside the IC between ADJ and GND and
between OUT and
ADJ.
CTL
Vcc Vcc
Vcc
OUT
ADJ
R1
R2
31.25kΩ 2kΩ
25kΩ
(BD00KA5WFP/WF)
Fig.18
Fig.19
Vcc
Fig.20 Power Dissipation heat
reducing characteristics
TO252-5
0.0
0.4
0.8
1.2
1.6
2.0
0
25
50
75
100
125
150
Ambient temperature:Ta(℃)
1.30
Rohm standard board mounting
Board size:70×70×1.6mm
Copper foil area:7×7mm
2
θja=96.2(℃/W)
TO252-3
Fig.21 Power Dissipation heat
reducing characteristics
0.0
0.4
0.8
1.2
1.6
2.0
0
25
50
75
100
125
150
周囲温度:Ta(℃)
1.20
Rohm standard board mounting
Board size:70×70×1.6mm
Copper foil area:7×7mm
2
θja=104.2(℃/W)
Ambient temperature:Ta(℃)
SOP8
Fig.22 Power Dissipation heat
reducing characteristics
0
200
400
600
800
1000
0
25
50
75
100
125
150
周囲温度:Ta(℃)
687.6mW
562.6mW
(1)
(2)
(1)When using a standard board:
θj-c=181.8(℃/W)
(2) When using an IC alone
θj-a=222.2(℃/W)
Ambient temperature:Ta(℃)


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