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BCX56-16.115 Datasheet(PDF) 6 Page - NXP Semiconductors

No. de pieza BCX56-16.115
Descripción Electrónicos  80 V, 1 A NPN medium power transistors
Download  15 Pages
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Fabricante Electrónico  NXP [NXP Semiconductors]
Página de inicio  http://www.nxp.com
Logo NXP - NXP Semiconductors

BCX56-16.115 Datasheet(HTML) 6 Page - NXP Semiconductors

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BC639_BCP56_BCX56_8
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 08 — 22 June 2007
6 of 15
NXP Semiconductors
BC639; BCP56; BCX56
80 V, 1 A NPN medium power transistors
6.
Thermal characteristics
[1]
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
[3]
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.
Table 7.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Rth(j-a)
thermal resistance from
junction to ambient
in free air
BC639
[1] -
-
150
K/W
BCP56
[1] -
-
195
K/W
[2] -
-
130
K/W
BCX56
[1] -
-
250
K/W
[2] -
-
145
K/W
[3] -
-
100
K/W
Rth(j-sp)
thermal resistance from
junction to solder point
BC639
-
-
40
K/W
BCP56
-
-
17
K/W
BCX56
-
-
30
K/W
FR4 PCB, standard footprint
Fig 4.
Transient thermal impedance from junction to ambient as a function of pulse duration for SOT54;
typical values
006aaa088
10−5
10
10−2
10−4
102
10−1
tp (s)
10−3
103
1
102
10
103
Zth(j-a)
(K/W)
1
0
duty cycle =
1
0.75
0.5
0.33
0.2
0.1
0.05
0.02
0.01


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