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FAN3122CMX Datasheet(PDF) 2 Page - Fairchild Semiconductor

No. de pieza FAN3122CMX
Descripción Electrónicos  Single 9-A High-Speed, Low-Side Gate Driver
Download  21 Pages
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Fabricante Electrónico  FAIRCHILD [Fairchild Semiconductor]
Página de inicio  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FAN3122CMX Datasheet(HTML) 2 Page - Fairchild Semiconductor

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© 2008 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN3121 / FAN3122 • Rev. 1.0.2
2
Ordering Information
Part Number
Logic
Input
Threshold
Package
Packing
Method
Quantity
per Reel
FAN3121CMPX
Inverting
Channels +
Enable
CMOS
3x3 mm MLP-8
Tape & Reel
3,000
FAN3121CMX
SOIC-8
Tape & Reel
2,500
FAN3121CMX_F085
(1)
SOIC-8
Tape & Reel
2,500
FAN3121TMPX
TTL
3x3 mm MLP-8
Tape & Reel
3,000
FAN3121TMX
SOIC-8
Tape & Reel
2,500
FAN3121TMX_F085
(1)
SOIC-8
Tape & Reel
2,500
FAN3122CMPX
Non-Inverting
Channels +
Enable
CMOS
3x3 mm MLP-8
Tape & Reel
3,000
FAN3122CMX
SOIC-8
Tape & Reel
2,500
FAN3122CMX_F085
(1)
SOIC-8
Tape & Reel
2,500
FAN3122TMPX
TTL
3x3 mm MLP-8
Tape & Reel
3,000
FAN3122TMX
SOIC-8
Tape & Reel
2,500
FAN3122TMX_F085
(1)
SOIC-8
Tape & Reel
2,500
All standard Fairchild Semiconductor products are RoHS compliant and many are also “Green” or going green. Green means the
products are RoHS compliant AND they have limits on additional substances of Chlorine, Bromine and Antimony. For additional
information on Fairchild’s “green” Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
Note:
1.
Qualified to AEC-Q100.
Package Outlines
Figure 3.
3x3 mm MLP-8 (Top View)
Figure 4.
SOIC-8 (Top View)
Thermal Characteristics
(2)
Package
JL
(3)
JT
(4)
JA
(5)
JB
(6)
JT
(7)
Units
8-Lead 3x3 mm Molded Leadless Package (MLP)
1.2
64
42
2.8
0.7
°C/W
8-Pin Small Outline Integrated Circuit (SOIC)
38
29
87
41
2.3
°C/W
Notes:
2.
Estimates derived from thermal simulation; actual values depend on the application.
3.
Theta_JL (
JL): Thermal resistance between the semiconductor junction and the bottom surface of all the leads
(including any thermal pad) that are typically soldered to a PCB.
4.
Theta_JT (
JT): Thermal resistance between the semiconductor junction and the top surface of the package,
assuming it is held at a uniform temperature by a top-side heatsink.
5.
Theta_JA (
ΘJA): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking,
and airflow. The value given is for natural convection with no heatsink, as specified in JEDEC standards
JESD51-2, JESD51-5, and JESD51-7, as appropriate.
6.
Psi_JB (
JB): Thermal characterization parameter providing correlation between semiconductor junction
temperature and an application circuit board reference point for the thermal environment defined in Note 5. For
the MLP-8 package, the board reference is defined as the PCB copper connected to the thermal pad and
protruding from either end of the package. For the SOIC-8 package, the board reference is defined as the PCB
copper adjacent to pin 6.
7.
Psi_JT (
JT): Thermal characterization parameter providing correlation between the semiconductor junction
temperature and the center of the top of the package for the thermal environment defined in Note 5.


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