3

Exposed

Thermal Pad

9

10

11

12

8

7

6

5

4

2

1

16

15

14

13

PVIN

PVIN

AVIN

SS/TR

SW

SW

SW

PG

TPS62140, TPS62140A

TPS62141, TPS62142, TPS62143

SLVSAJ0B – NOVEMBER 2011 – REVISED JUNE 2013

www.ti.com

DEVICE INFORMATION

RGT PACKAGE

(TOP VIEW)

Terminal Functions

I/O

DESCRIPTION

NAME

NO.

SW

1, 2 ,3

O

Switch node, which is connected to the internal MOSFET switches. Connect inductor between SW and

output capacitor.

PG

4

O

Output power-good (High = VOUT ready, Low = VOUT below nominal regulation); open-drain (requires

pullup resistor; goes high-impedance when device is switched off)

FB

5

I

Voltage feedback of adjustable version. Connect resistive voltage divider to this pin. Its recommended to

connect FB to AGND on fixed output-voltage versions for improved thermal performance.

AGND

6

–

Analog ground. Must be connected directly to the Exposed Thermal Pad and common ground plane.

FSW

7

I

Switching frequency select (Low

DEF

8

I

Soft-start / tracking pin. An external capacitor connected to this pin sets the internal voltage-reference rise

SS/TR

9

I

time. It can be used for tracking and sequencing.

AVIN

10

I

Supply voltage for control circuitry. Connect to same source as PVIN.

PVIN

11, 12

I

Supply voltage for power stage. Connect to same source as AVIN.

EN

13

I

VOS

14

I

Output-voltage sense pin and connection for the control loop circuitry.

PGND

15, 16

–

Power ground. Must be connected directly to the Exposed Thermal Pad and common ground plane.

Exposed

–

thermal pad

to achieve appropriate power dissipation and mechanical reliability.

(1)

For more information about connecting pins, see the DETAILED DESCRIPTION and APPLICATION INFORMATION sections.

(2)

Connect FSW to VOUT or PG in this case.

(3)

An internal pulldown resistor keeps the logic level low, if pin is floating.

(4)

See Figure 41.

4

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