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6-104652-0 Datasheet(PDF) 7 Page - Tyco Electronics

No. de pieza 6-104652-0
Descripción Electrónicos  Fine Pitch SMT Stacking Connectors
Download  13 Pages
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Fabricante Electrónico  MACOM [Tyco Electronics]
Página de inicio  http://www.macom.com
Logo MACOM - Tyco Electronics

6-104652-0 Datasheet(HTML) 7 Page - Tyco Electronics

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94
Catalog 889092
Dimensions are in millimeters
Dimensions are shown for
USA: 1-800-522-6752
South America: 55-11-3611-1514
Revised 9-06
and inches unless otherwise
reference purposes only.
Canada: 1-905-470-4425
Hong Kong: 852-2735-1628
specified. Values in brackets
Specifications subject
Mexico: 01-800-733-8926
Japan: 81-44-844-8013
www.tycoelectronics.com
are standard equivalents.
to change.
C. America: 52-55-5-729-0425
UK: 44-141-810-8967
Fine Pitch SMT Stacking Connectors
(Parallel Board-to-Board)
Board-to-Board Right Angle Headers
AMPMODU 50/50 Grid
Right Angle Headers will
accommodate a variety of
high density packaging
applications; right angle
board-to-board applications
when mated with vertical
receptacles (page 91) and
right angle cable-to-board
applications when mated
with cable connectors
(page 97). The small
1.27 x 1.27 [.050 x .050]
centerline contact spacing
allows efficient use of the
PC board area.
Mechanical support of the
headers to the PC board is
provided by non-protrusive
metallic holddowns
designed for 1.57 [.062] or
thicker PC boards. These
holddowns are of the same
design as those used in the
vertical headers (page 92)
and receptacles (page 91).
There are also metallic tabs
that are soldered to the sur-
faces of the PC board pads
for added support.
AMPMODU 50/50 Grid
Right Angle Headers are
available in dual-row, in
either latching or non-
latching versions, and in
sizes ranging from 10
through 100 positions (in
10 position increments).
The latching version pro-
vides positive retention
when mated with the latch-
ing cable connector (page
97). All headers feature
polarization to help prevent
misalignment during mating.
Product Facts
Surface-mount products for
right angle board-to-board
and cable-to-board
applications
Dual-row, right angle
shrouded headers
High density 1.27 x 1.27
[.050 x .050] centerline grid
Latching and non-latching
versions available
Non-protrusive metallic
holddowns
Metallic tabs, when
soldered to PC board pad,
provide added mechanical
support
Duplex plated post contacts;
gold plated on mating area,
tin plated on tails
Compatible with standard
surface-mount processing
(VPR and IR)
Standoffs on header
housings allow for drainage
of processing fluids
All headers are polarized
Sizes of 10, 20, 30, 40, 50,
60, 70, 80 and 100 positions
Recognized under the
Component Program of
Underwriters
Laboratories Inc.,
File No. E28476
Certified by Canadian
Standards
Association
File No. LR7189
R
R
See Catalog 1307819 for
additional AMPMODU product
offerings.


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