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Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-1206EN

AV02-0069EN - September 2, 2008

(L) Recommended Reflow Soldering Profile and Soldering Pad Pattern for SMT Options

Recommended SnPb reflow soldering profile.

Wait until device has cooled to room temperature before handling.

Recommended soldering pad pattern for gull wing leads 11, 12, and 14.

Recommended soldering pad pattern for yoke leads 21, 22, and 24.

Recommended soldering pad pattern for Z-bend leads 31, 32, and 34.

3.30 (0.130)

6.60 (0.260)

0.64 (0.025)

1.27

(0.50)

0.45

(0.018)

0.89

(0.035)

#27 DRILL

3.73 (0.147) DIA.

CLEARANCE HOLE

THROUGH PC BOARD

DIMENSIONS ARE IN

MILLIMETERS (INCHES)

3.30 (0.130)

6.60 (0.260)

1.27

(0.50)

0.45

(0.018)

0.89

(0.035)

#27 DRILL

3.73 (0.147) DIA.

CLEARANCE HOLE

THROUGH PC BOARD

DIMENSIONS ARE IN

MILLIMETERS (INCHES)

0.89

(0.035)

1.78

(0.070)

3.58 (0.140)

0.45

(0.018)

0.45 (0.018)

0.89 (0.035)

230

10 SEC. MAX.

2-3°C/SEC.

120 SEC. MAX.

TIME

183°C

125-170°C

3-4°C/SEC.

60-150

SEC.

3°C/SEC. MAX.

25°C

50°C

°C MAX.

+5

–0

Recommended Pb-free reflow soldering profile.

217

°C

200

°C

60 - 120 SEC.

6

°C/SEC. MAX.

3

°C/SEC. MAX.

3

°C/SEC. MAX.

150

°C

255 - 260

°C

100 SEC. MAX.

(Acc. to J-STD-020C)

10 - 30 SEC.

TIME