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TPS7A8300RGRT Datasheet(PDF) 2 Page - Texas Instruments |
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TPS7A8300RGRT Datasheet(HTML) 2 Page - Texas Instruments |
2 / 33 page TPS7A8300 SBVS197C – MAY 2013 – REVISED JULY 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) PRODUCT DESCRIPTION YYY is the package designator. TPS7A8300YYYZ Z is the package quantity. (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the device product folder at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range, unless otherwise noted. VALUE MIN MAX UNIT IN, BIAS, PG, EN –0.3 +7.0 V IN, BIAS, PG, EN (5% duty cycle) –0.3 +7.5 V Voltage SNS, OUT –0.3 VIN + 0.3 (2) V NR/SS, FB –0.3 +3.6 V 50 mV, 100 mV, 200 mV, 400 mV, 800 mV, 1.6 V –0.3 VOUT + 0.3 V OUT Internally limited A Current PG (sink current into device) 5 mA Operating junction temperature, TJ –55 +150 °C Temperature Storage, Tstg –55 +150 °C Human body model (HBM), JESD22-A114A 2 kV Electrostatic discharge (ESD) ratings(3) Charged device model (CDM), JESD22-C101B.01 500 V (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute- maximum-rated conditions for extended periods may affect device reliability. (2) The absolute maximum rating is VIN + 0.3 V or +7.0 V, whichever is smaller. (3) ESD testing is performed according to the respective JESD22 JEDEC standard. THERMAL INFORMATION TPS7A8300 THERMAL METRIC(1) RGW (QFN) UNITS 20 PINS θJA Junction-to-ambient thermal resistance 35.7 θJCtop Junction-to-case (top) thermal resistance 33.6 θJB Junction-to-board thermal resistance 15.2 °C/W ψJT Junction-to-top characterization parameter 0.4 ψJB Junction-to-board characterization parameter 15.4 θJCbot Junction-to-case (bottom) thermal resistance 3.8 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953A. 2 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: TPS7A8300 |
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