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74LVC1G125GN Datasheet(PDF) 2 Page - NXP Semiconductors

No. de pieza 74LVC1G125GN
Descripción Electrónicos  Bus buffer/line driver; 3-state
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Fabricante Electrónico  PHILIPS [NXP Semiconductors]
Página de inicio  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

74LVC1G125GN Datasheet(HTML) 2 Page - NXP Semiconductors

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74LVC1G125
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 11 — 2 July 2012
2 of 20
NXP Semiconductors
74LVC1G125
Bus buffer/line driver; 3-state
3.
Ordering information
4.
Marking
[1]
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
5.
Functional diagram
Table 1.
Ordering information
Type number
Package
Temperature range
Name
Description
Version
74LVC1G125GW
40 Cto+125 C
TSSOP5
plastic thin shrink small outline package; 5 leads;
body width 1.25 mm
SOT353-1
74LVC1G125GV
40 Cto+125 C
SC-74A
plastic surface-mounted package; 5 leads
SOT753
74LVC1G125GM
40 Cto+125 C
XSON6
plastic extremely thin small outline package;
no leads; 6 terminals; body 1
 1.45  0.5 mm
SOT886
74LVC1G125GF
40 C to +125 C
XSON6
plastic extremely thin small outline package;
no leads; 6 terminals; body 1
 1  0.5 mm
SOT891
74LVC1G125GN
40 C to +125 C
XSON6
extremely thin small outline package; no leads;
6 terminals; body 0.9
 1.0  0.35 mm
SOT1115
74LVC1G125GS
40 C to +125 C
XSON6
extremely thin small outline package; no leads;
6 terminals; body 1.0
 1.0  0.35 mm
SOT1202
74LVC1G125GX
40 C to +125 C
X2SON5
X2SON5: plastic thermal enhanced extremely thin
small outline package; no leads; 5 terminals;
body 0.8
 0.8  0.35 mm
SOT1226
Table 2.
Marking
Type number
Marking code[1]
74LVC1G125GW
VM
74LVC1G125GV
V25
74LVC1G125GM
VM
74LVC1G125GF
VM
74LVC1G125GN
VM
74LVC1G125GS
VM
74LVC1G125GX
VM
Fig 1.
Logic symbol
Fig 2.
IEC logic symbol
Fig 3.
Logic diagram
mna118
AY
2
1
4
OE
mna119
1
4
2
EN
mna120
A
Y
OE


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