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TPS72718YFFT Datasheet(PDF) 11 Page - Texas Instruments

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No. de pieza TPS72718YFFT
Descripción Electrónicos  250mA, Ultralow IQ, Fast Transient Response, RF LOW-DROPOUT LINEAR REGULATOR
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Fabricante Electrónico  TI [Texas Instruments]
Página de inicio  http://www.ti.com
Logo TI - Texas Instruments

TPS72718YFFT Datasheet(HTML) 11 Page - Texas Instruments

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P =(V
V
)
I
-
D
IN
OUT
OUT
´
TPS727xx
www.ti.com
SBVS128C – JUNE 2009 – REVISED JANUARY 2011
DROPOUT VOLTAGE
(including
heatsink),
increase
the
ambient
temperature until the thermal protection is triggered;
The TPS727xx uses a PMOS pass transistor to
use worst-case loads and signal conditions. For good
achieve low dropout. When (VIN – VOUT) is less than
reliability, thermal protection should trigger at least
the dropout voltage (VDO), the PMOS pass device is
+35°C
above
the
maximum
expected
ambient
in
the
linear
region
of
operation
and
the
condition
of
your
particular
application.
This
input-to-output resistance is the RDS(ON) of the PMOS
configuration
produces
a
worst-case
junction
pass element. VDO approximately scales with output
temperature of +125°C at the highest expected
current because the PMOS device behaves like a
ambient temperature and worst-case load.
resistor in dropout.
The internal protection circuitry of the TPS727xx has
As with any linear regulator, PSRR and transient
been designed to protect against overload conditions.
response are degraded as (VIN – VOUT) approaches
It is not intended to replace proper heatsinking.
dropout. This effect is shown in Figure 16 in the
Continuously running the TPS727xx into thermal
Typical Characteristics section.
shutdown degrades device reliability.
TRANSIENT RESPONSE
Power Dissipation
As with any regulator, increasing the size of the
The ability to remove heat from the die is different for
output capacitor reduces over/undershoot magnitude
each
package
type,
presenting
different
but increases duration of the transient response.
considerations in the printed circuit board (PCB)
layout. The PCB area around the device that is free
UNDERVOLTAGE LOCK-OUT (UVLO)
of other components moves the heat from the device
to the ambient air. Performance data for JEDEC low-
The TPS727xx uses an undervoltage lock-out circuit
and high-K boards are given in the Dissipation
that keeps the output shut off until the input voltage
Ratings table. Using heavier copper increases the
reaches the UVLO threshold voltage.
effectiveness in removing heat from the device. The
addition of plated through-holes to heat-dissipating
THERMAL INFORMATION
layers also improves the heatsink effectiveness.
Thermal Protection
Power dissipation depends on input voltage and load
conditions. Power dissipation (PD) is equal to the
Thermal protection disables the output when the
product of the output current times the voltage drop
junction temperature rises to approximately +160°C,
across the output pass element (VIN to VOUT), as
allowing the device to cool. When the junction
shown in Equation 2:
temperature cools to approximately +140°C the
output circuitry is again enabled. Depending on power
(2)
dissipation,
thermal
resistance,
and
ambient
temperature, the thermal protection circuit may cycle
Package Mounting
on and off. This cycling limits the dissipation of the
Solder
pad
footprint
recommendations
for
the
regulator, protecting it from damage as a result of
TPS727xx are available from the Texas Instruments
overheating.
web site at www.ti.com.
Any tendency to activate the thermal protection circuit
The recommended land pattern for the DSE package
indicates
excessive
power
dissipation
or
an
is shown in Figure 26. Figure 27 shows the
inadequate heatsink. For reliable operation, junction
dimensions of the YFF package.
temperature should be limited to +125°C maximum.
To estimate the margin of safety in a complete design
Copyright © 2009–2011, Texas Instruments Incorporated
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