TPS53318, TPS53319

SLUSAY8B – JUNE 2012 – REVISED MAY 2013

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

ORDERING PART

MINIMUM

PACKAGE

PINS

OUTPUT SUPPLY

ECO PLAN

NUMBER

QUANTITY

TPS53318DQPR

Tape and reel

2500

TPS53318DQPT

Mini reel

250

Plastic QFN

Pb-Free (RoHS

–40°C to 85°C

22

(DQP)

Exempt)

TPS53319DQPR

Tape and reel

2500

TPS53319DQPT

Mini reel

250

ABSOLUTE MAXIMUM RATINGS

(1)

VALUE

UNIT

MIN

MAX

VIN (main supply)

–0.3

30

VDD

–0.3

28

Input voltage range

VBST

–0.3

32

V

VBST(with respect to LL)

–0.3

7

EN, TRIP, VFB, RF, MODE, ROVP

–0.3

7

DC

–2

30

LL

Pulse < 20ns, E=5

μJ

–7

32

Output voltage range

V

PGOOD, VREG

–0.3

7

GND

–0.3

0.3

Source/Sink current

VBST

50

mA

–40

85

–55

150

˚C

–40

150

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

300

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

THERMAL INFORMATION

TPS53319

UNITS

DQP (22 PINS)

Junction-to-ambient thermal resistance

27.2

Junction-to-case (top) thermal resistance

17.1

Junction-to-board thermal resistance

5.9

°C/W

Junction-to-top characterization parameter

0.8

Junction-to-board characterization parameter

5.8

Junction-to-case (bottom) thermal resistance

1.2

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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