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ADS58H40IZCRR Datasheet(PDF) 2 Page - Texas Instruments |
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ADS58H40IZCRR Datasheet(HTML) 2 Page - Texas Instruments |
2 / 59 page ADS58H40 SBAS589B – AUGUST 2012 – REVISED NOVEMBER 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. PACKAGE AND ORDERING INFORMATION(1) SPECIFIED LEAD AND PACKAGE PACKAGE ORDERING PACKAGE- TRANSPORT TEMPERATURE BALL PRODUCT ECO PLAN(2) LEAD MEDIA DESIGNATOR MARKING NUMBER RANGE FINISH ADS58H40IZCR Tray GREEN (RoHS, ADS58H40 BGA-144 ZCR –40°C to +85°C CuNiPdAu ADS58H40I no SB or BR) ADS58H40IZCRR Tape and Reel (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. (2) These packages conform to Lead (Pb)-free and green manufacturing specifications. Additional details including specific material content can be accessed at www.ti.com/leadfree. GREEN: TI defines Green to mean Lead (Pb)-Free and in addition, uses less package materials that do not contain halogens, including bromine (Br), or antimony (Sb) above 0.1% of total product weight. N/A: Not yet available Lead (Pb)-Free; for estimated conversion dates, go to www.ti.com/leadfree. Pb-FREE: TI defines Lead (Pb)-Free to mean RoHS compatible, including a lead concentration that does not exceed 0.1% of total product weight, and, if designed to be soldered, suitable for use in specified lead-free soldering processes. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range, unless otherwise noted. VALUE UNIT AVDD33 –0.3 to +3.6 V Supply voltage range AVDD –0.3 to +2.1 V DRVDD –0.3 to +2.1 V AVSS and DRVSS –0.3 to +0.3 V AVDD and DRVDD –2.4 to +2.4 V Voltage between AVDD33 and DRVDD –2.4 to +3.9 V AVDD33 and AVDD –2.4 to +3.9 V XINP, XINM –0.3 to minimum (1.9, AVDD + 0.3) V Voltage applied to input pins CLKP, CLKM(2) –0.3 to minimum (1.9, AVDD + 0.3) V RESET, SCLK, SDATA, SEN, SNRB, TRIG_EN, PDN –0.3 to +3.9 V Operating free-air, TA –40 to +85 °C Temperature Operating junction, TJ +150 °C Storage, Tstg –65 to +150 °C Electrostatic discharge (ESD) Human body model (HBM) 2 kV ratings (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. (2) When AVDD is turned off, TI recommends switching off the input clock (or ensuring the voltage on CLKP and CLKM is less than | 0.3 V |). This recommendation prevents the ESD protection diodes at the clock input pins from turning on. 2 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: ADS58H40 |
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