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ADS58H40IZCRR Datasheet(PDF) 2 Page - Texas Instruments

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No. de pieza ADS58H40IZCRR
Descripción Electrónicos  Quad-Channel, 250-MSPS Receiver and Feedback ADC
Download  59 Pages
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Fabricante Electrónico  TI [Texas Instruments]
Página de inicio  http://www.ti.com
Logo TI - Texas Instruments

ADS58H40IZCRR Datasheet(HTML) 2 Page - Texas Instruments

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ADS58H40
SBAS589B – AUGUST 2012 – REVISED NOVEMBER 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE AND ORDERING INFORMATION(1)
SPECIFIED
LEAD AND
PACKAGE
PACKAGE
ORDERING
PACKAGE-
TRANSPORT
TEMPERATURE
BALL
PRODUCT
ECO PLAN(2)
LEAD
MEDIA
DESIGNATOR
MARKING
NUMBER
RANGE
FINISH
ADS58H40IZCR
Tray
GREEN (RoHS,
ADS58H40
BGA-144
ZCR
–40°C to +85°C
CuNiPdAu
ADS58H40I
no SB or BR)
ADS58H40IZCRR
Tape and Reel
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
(2)
These packages conform to Lead (Pb)-free and green manufacturing specifications. Additional details including specific material content
can be accessed at www.ti.com/leadfree.
GREEN: TI defines Green to mean Lead (Pb)-Free and in addition, uses less package materials that do not contain halogens, including
bromine (Br), or antimony (Sb) above 0.1% of total product weight.
N/A: Not yet available Lead (Pb)-Free; for estimated conversion dates, go to www.ti.com/leadfree.
Pb-FREE: TI defines Lead (Pb)-Free to mean RoHS compatible, including a lead concentration that does not exceed 0.1% of total
product weight, and, if designed to be soldered, suitable for use in specified lead-free soldering processes.
ABSOLUTE MAXIMUM RATINGS
(1)
Over operating free-air temperature range, unless otherwise noted.
VALUE
UNIT
AVDD33
–0.3 to +3.6
V
Supply voltage range
AVDD
–0.3 to +2.1
V
DRVDD
–0.3 to +2.1
V
AVSS and DRVSS
–0.3 to +0.3
V
AVDD and DRVDD
–2.4 to +2.4
V
Voltage between
AVDD33 and DRVDD
–2.4 to +3.9
V
AVDD33 and AVDD
–2.4 to +3.9
V
XINP, XINM
–0.3 to minimum (1.9, AVDD + 0.3)
V
Voltage applied to input pins
CLKP, CLKM(2)
–0.3 to minimum (1.9, AVDD + 0.3)
V
RESET, SCLK, SDATA, SEN, SNRB, TRIG_EN, PDN
–0.3 to +3.9
V
Operating free-air, TA
–40 to +85
°C
Temperature
Operating junction, TJ
+150
°C
Storage, Tstg
–65 to +150
°C
Electrostatic discharge (ESD)
Human body model (HBM)
2
kV
ratings
(1)
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2)
When AVDD is turned off, TI recommends switching off the input clock (or ensuring the voltage on CLKP and CLKM is less than
| 0.3 V |). This recommendation prevents the ESD protection diodes at the clock input pins from turning on.
2
Submit Documentation Feedback
Copyright © 2012, Texas Instruments Incorporated
Product Folder Links: ADS58H40


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