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ISL32493EIBZ Datasheet(PDF) 2 Page - Intersil Corporation |
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ISL32493EIBZ Datasheet(HTML) 2 Page - Intersil Corporation |
2 / 22 page ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E 2 FN7786.2 March 16, 2012 TABLE 1. SUMMARY OF FEATURES PART NUMBER HALF/FULL DUPLEX DATA RATE (Mbps) SLEW-RATE LIMITED? EN PINS? HOT PLUG? QUIESCENT ICC (mA) LOW POWER SHDN? PIN COUNT ISL32490E Full 0.25 Yes Yes Yes 2.3 Yes 10, 14 ISL32492E Half 0.25 Yes Yes Yes 2.3 Yes 8 ISL32493E Full 1 Yes Yes Yes 2.3 Yes 10, 14 ISL32495E Half 1 Yes Yes Yes 2.3 Yes 8 ISL32496E Full 15 No Yes Yes 2.3 Yes 10, 14 ISL32498E Half 15 No Yes Yes 2.3 Yes 8 Ordering Information PART NUMBER (Notes 1, 2, 3) PART MARKING TEMP. RANGE (°C) PACKAGE (Pb-Free) PKG. DWG. # ISL32490EIBZ ISL32490 EIBZ -40 to +85 14 Ld SOIC M14.15 ISL32490EIUZ 2490E -40 to +85 10 Ld MSOP M10.118 ISL32492EIBZ 32492 EIBZ -40 to +85 8 Ld SOIC M8.15 ISL32492EIUZ 2492E -40 to +85 8 Ld MSOP M8.118 ISL32493EIBZ ISL32493 EIBZ -40 to +85 14 Ld SOIC M14.15 ISL32493EIUZ 2493E -40 to +85 10 Ld MSOP M10.118 ISL32495EIBZ 32495 EIBZ -40 to +85 8 Ld SOIC M8.15 ISL32495EIUZ 2495E -40 to +85 8 Ld MSOP M8.118 ISL32496EIBZ ISL32496 EIBZ -40 to +85 14 Ld SOIC M14.15 ISL32496EIUZ 2496E -40 to +85 10 Ld MSOP M10.118 ISL32498EIBZ 32498 EIBZ -40 to +85 8 Ld SOIC M8.15 ISL32498EIUZ 2498E -40 to +85 8 Ld MSOP M8.118 NOTES: 1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), please see device information pages for ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, ISL32498E. For more information on MSL please see techbrief TB363. |
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