TPS61087

SLVS821C – MAY 2008 – REVISED JULY 2013

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING

PACKAGE

PACKAGE MARKING

–40 to 85°C

TPS61087DRC

QFN-10 (DRC)

PMOQ

TPS61087DSC

QFN-10 (DSC)

PMWI

(1)

The DRC package is available taped and reeled.

(2)

For the most current package and ordering information, see the Package Option Addendum at the end

of this document, or see the TI website at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range (unless otherwise noted)

(1)

VALUE

UNIT

–0.3 to 7.0

V

Voltage range on pins EN, FB, SS, FREQ, COMP

–0.3 to 7.0

V

Voltage on pin SW

–0.3 to 20

V

ESD rating HBM

2

kV

ESD rating MM

200

V

ESD rating CDM

500

V

Continuous power dissipation

See Dissipation Rating Table

Operating junction temperature range

–40 to 150

°C

Storage temperature range

–65 to 150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability

(2)

All voltage values are with respect to network ground terminal.

DISSIPATION RATINGS

(1) (2)

PACKAGE

POWER RATING

POWER RATING

POWER RATING

QFN

1.74 W

0.96 W

0.70 W

(1)

(2)

The exposed thermal die is soldered to the PCB using thermal vias. For more information, see the

Texas Instruments Application report SLMA002 regarding thermal characteristics of the PowerPAD

package.

RECOMMENDED OPERATING CONDITIONS

MIN

TYP

MAX

UNIT

Input voltage range

2.5

6

V

Boost output voltage range

18.5

V

Operating free-air temperature

–40

85

°C

Operating junction temperature

–40

125

°C

2

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