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ADA4841-2YRMZ-R7 Datasheet(PDF) 7 Page - Analog Devices

No. de pieza ADA4841-2YRMZ-R7
Descripción Electrónicos  Low Power, Low Noise and Distortion ail-to-Rail Output Amplifiers
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Fabricante Electrónico  AD [Analog Devices]
Página de inicio  http://www.analog.com
Logo AD - Analog Devices

ADA4841-2YRMZ-R7 Datasheet(HTML) 7 Page - Analog Devices

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ADA4841-1/ADA4841-2
Rev. E | Page 6 of 20
ABSOLUTE MAXIMUM RATINGS
PD = Quiescent Power + (Total Drive Power − Load Power)
Table 4.
Parameter
Rating
Supply Voltage
12.6 V
Power Dissipation
See Figure 5
Common-Mode Input Voltage
−VS − 0.5 V to +VS + 0.5 V
Differential Input Voltage
±1.8 V
Storage Temperature Range
−65°C to +125°C
Operating Temperature Range
−40°C to +125°C
Lead Temperature
JEDEC J-STD-20
Junction Temperature
150°C
()
L
OUT
L
OUT
S
S
S
D
R
V
R
V
V
I
V
P
2
2
⎟⎟
⎜⎜
×
+
×
=
RMS output voltages should be considered. If RL is referenced
to −VS, as in single-supply operation, the total drive power is
VS × IOUT. If the rms signal levels are indeterminate, consider the
worst case, when VOUT = VS/4 for RL to midsupply.
() (
)
L
S
S
S
D
R
V
I
V
P
2
4
/
+
×
=
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
In single-supply operation with RL referenced to −VS, worst case
is VOUT = VS/2.
Airflow increases heat dissipation, effectively reducing θJA.
In addition, more metal directly in contact with the package
leads and through holes under the device reduces θJA.
Figure 5 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 8-lead SOIC_N
(125°C/W), the 6-lead SOT-23 (170°C/W), 8-lead MSOP
(145°C/W), and 8-lead LFCSP_WD (103°C/W) on a JEDEC
standard 4-layer board. θJA values are approximations.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, θJA is
specified for device soldered in circuit board for surface-mount
packages.
Table 5. Thermal Resistance
2.0
0
–55
125
AMBIENT TEMPERATURE (°C)
1.5
1.0
0.5
–45 –35 –25 –15 –5
5
15 25 35 45 55 65 75 85 95 105 115
SOT-23
SOIC
MSOP
LFCSP
Package Type
θJA
Unit
8-lead SOIC_N
125
°C/W
6-Lead SOT-23
170
°C/W
8-lead MSOP
130
°C/W
8-Lead LFCSP_WD
103
°C/W
MAXIMUM POWER DISSIPATION
The maximum safe power dissipation for the ADA4841-1/
ADA4841-2 is limited by the associated rise in junction
temperature (TJ) on the die. At approximately 150°C, which is
the glass transition temperature, the plastic changes its
properties. Even temporarily exceeding this temperature limit
may change the stresses that the package exerts on the die,
permanently shifting the parametric performance of the
amplifiers. Exceeding a junction temperature of 150°C for an
extended period can result in changes in silicon devices,
potentially causing degradation or loss of functionality.
Figure 5. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
ESD CAUTION
The power dissipated in the package (PD) is the sum of the
quiescent power dissipation and the power dissipated in the die
due to the amplifier’s drive at the output. The quiescent power is
the voltage between the supply pins (VS) times the quiescent
current (IS).


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