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LM2991TLB03 Datasheet(PDF) 6 Page - Texas Instruments

No. de pieza LM2991TLB03
Descripción Electrónicos  LM2991 Negative Low Dropout Adjustable Regulator
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LM2991TLB03 Datasheet(HTML) 6 Page - Texas Instruments

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LM2991
SNVS099H – MAY 1999 – REVISED JUNE 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Adjust Pin Current
Low Voltage Behavior
Figure 15.
Figure 16.
Maximum Power
Maximum Power Dissipation
Dissipation (TO-220)
(DDPAK/TO-263)(1)
Figure 17.
Figure 18.
(1)
The maximum allowable power dissipation is a function of the maximum operating junction temperature (TJ(MAX)), the thermal resistance
of the package (
θJA), and the ambient temperature (TA). The maximum allowable power dissipation is: PD = (TJ(MAX) − TA)/θJA, where
TJ(MAX) is 125°C, and TA is the maximum expected ambient temperature. If this dissipation is exceeded, the die temperature will rise
above 125°C. Excessive power dissipation will cause the LM2991 to go into thermal shutdown (See Thermal Shutdown). For the
LM2991, the junction-to-ambient thermal resistance is 53°C/W for the TO-220, 73°C/W for the DDPAK/TO-263, and junction-to-case
thermal resistance is 3°C/W. If the DDPAK/TO-263 package is used, the thermal resistance can be reduced by increasing the PC board
copper area thermally connected to the package. Using 0.5 square inches of copper area,
θJA is 50°C/W; with 1 square inch of copper
area,
θJA is 37°C/W; and with 1.6 or more square inches of copper area, θJA is 32°C/W.
6
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