TPS2834, TPS2835

SYNCHRONOUSBUCK MOSFET DRIVERS

WITH DEADTIME CONTROL

SLVS223B − NOVEMBER 1999 − REVISED AUGUST 2002

4

POST OFFICE BOX 655303

detailed description (continued)

SYNC

The SYNC terminal controls whether the drivers operate in synchronous or nonsynchronous mode. In

synchronous mode, the low-side FET is operated as a synchronous rectifier. In nonsynchronous mode, the

low-side FET is always off. SYNC is a TTL-compatible digital terminal.

CROWBAR

The CROWBAR terminal overrides the normal operation of the driver. When CROWBAR is low, the low-side

FET turns on to act as a clamp, protecting the output voltage of the dc/dc converter against overvoltages due

TTL-compatible digital terminal.

−0.3 V to 16 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage range: BOOT to PGND (high-side driver ON)

−0.3 V to 30 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

BOOTLO to PGND

−0.3 V to 16 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

BOOT to BOOTLO

−0.3 V to 16 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

ENABLE, SYNC, and CROWBAR

−0.3 V to 16 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

IN

−0.3 V to 16 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

DT

−0.3 V to 30 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous total power dissipation

See Dissipation Rating Table

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−40

°C to 125°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature soldering 1,6 mm (1/16 inch) from case for 10 seconds

260

°C

. . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTE 1: Unless otherwise specified, all voltages are with respect to PGND.

DISSIPATION RATING TABLE

PACKAGE

TA ≤ 25°C

DERATING FACTOR

TA = 70°C

TA = 85°C

PWP with solder‡

2668

26.68 mW/

°C

1467

1067

PWP without solder‡

1024

10.24 mW/

°C

563

409

D

749

7.49 mW/

°C

412

300

JUNCTION-CASE THERMAL RESISTANCE TABLE

PWP

Junction-case thermal resistance

2.07

°C/W

‡ Test Board Conditions:

1. Thickness: 0.062

I

2. 3

I × 3I (for packages <27 mm long)

3. 4

I × 4I (for packages >27 mm long)

4. 2-oz copper traces located on the top of the board (0.071 mm thick)

5. Copper areas located on the top and bottom of the PCB for soldering

6. Power and ground planes, 1-oz copper (0.036 mm thick)

7. Thermal vias, 0.33 mm diameter, 1.5 mm pitch

8. Thermal isolation of power plane

For more information, refer to TI technical brief literature number SLMA002.