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ADP3338AKC-1.5-RL Datasheet(PDF) 11 Page - Analog Devices |
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ADP3338AKC-1.5-RL Datasheet(HTML) 11 Page - Analog Devices |
11 / 16 page ADP3338 Rev. B | Page 11 of 16 Use the following general guidelines when designing printed circuit boards: • Keep the output capacitor as close as possible to the output and ground pins. • Keep the input capacitor as close as possible to the input and ground pins. • Specify thick copper and use wide traces for optimum heat transfer. PC board traces with larger cross sectional areas remove more heat from the ADP3338. • Decrease thermal resistance by adding a copper pad under the ADP3338, as shown in Figure 22 (b). • Use the adjacent area to the ADP3338 to add more copper around it. Connecting the copper area to the output of the ADP3338, as shown in Figure 22 (c), is best, but thermal performance will be improved even if it is connected to other signals. • Use additional copper layers or planes to reduce the thermal resistance. Again, connecting the other layers to the output of the ADP3338 is best, but is not necessary. When connecting the output pad to other layers, use multiple vias. |
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