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SI7430DP Datasheet(PDF) 1 Page - Vaishali Semiconductor

No. de pieza SI7430DP
Descripción Electrónicos  N-Channel 150 V (D-S) MOSFET
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Fabricante Electrónico  VAISH [Vaishali Semiconductor]
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Vishay Siliconix
Si7430DP
Document Number: 74282
S11-0212-Rev. C, 14-Feb-11
www.vishay.com
1
N-Channel 150 V (D-S) MOSFET
FEATURES
Halogen-free According to IEC 61249-2-21
Definition
Extremely Low Qgd for Reduced dV/dt, Qgd and
Shoot-Through
100 % Rg Tested
100 % UIS Tested
Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
Primary Side Switch
Single-Ended Power Switch
PRODUCT SUMMARY
VDS (V)
RDS(on) (Ω)
ID (A)
a
Qg (Typ.)
150
0.045 at VGS = 10 V
26
23 nC
0.047 at VGS = 8 V
25
Ordering Information: Si7430DP-T1-E3 (Lead (Pb)-free)
Si7430DP-T1-GE3 (Lead (Pb)-free and Halogen-free)
1
2
3
4
5
6
7
8
S
S
S
G
D
D
D
D
6.15 mm
5.15 mm
PowerPAK SO-8
Bottom View
N-Channel MOSFET
G
D
S
Notes:
a. Based on TC = 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 65 °C/W.
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
VDS
150
V
Gate-Source Voltage
VGS
± 20
Continuous Drain Current (TJ = 150 °C)
TC = 25 °C
ID
26
A
TC = 70 °C
21
TA = 25 °C
7.2b, c
TA = 70 °C
5.7b, c
Pulsed Drain Current
IDM
50
Continuous Source-Drain Diode Current
TC = 25 °C
IS
32
TA = 25 °C
4.5b, c
Single Pulse Avalanche Current
L = 0.1 mH
IAS
20
Single Pulse Avalanche Energy
EAS
20
mJ
Maximum Power Dissipation
TC = 25 °C
PD
64
W
TC = 70 °C
44
TA = 25 °C
5.2b, c
TA = 70 °C
3.3b, c
Operating Junction and Storage Temperature Range
TJ, Tstg
- 55 to 150
°C
Soldering Recommendations (Peak Temperature)d, e
260
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambientb, f
t
≤ 10 s
RthJA
19
24
°C/W
Maximum Junction-to-Case (Drain)
Steady State
RthJC
1.5
1.8


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