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AD8278ARZ-RL Datasheet(PDF) 7 Page - Analog Devices |
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AD8278ARZ-RL Datasheet(HTML) 7 Page - Analog Devices |
7 / 24 page AD8278/AD8279 Rev. C | Page 7 of 24 ABSOLUTE MAXIMUM RATINGS Table 6. Parameter Rating Supply Voltage ±18 V Maximum Voltage at Any Input Pin −VS + 40 V Minimum Voltage at Any Input Pin +VS − 40 V Storage Temperature Range −65°C to +150°C Specified Temperature Range −40°C to +85°C Package Glass Transition Temperature (TG) 150°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE The θJA values in Table 7 assume a 4-layer JEDEC standard board with zero airflow. Table 7. Thermal Resistance Package Type θJA Unit 8-Lead MSOP 135 °C/W 8-Lead SOIC 121 °C/W 14-Lead SOIC 105 °C/W MAXIMUM POWER DISSIPATION The maximum safe power dissipation for the AD8278 and AD8279 are limited by the associated rise in junction tempera- ture (TJ) on the die. At approximately 150°C, which is the glass transition temperature, the properties of the plastic change. Even temporarily exceeding this temperature limit may change the stresses that the package exerts on the die, permanently shifting the parametric performance of the amplifiers. Exceeding a temperature of 150°C for an extended period may result in a loss of functionality. 2.0 1.6 1.2 0.8 0.4 0 –50 0 –25 255075 100 125 AMBIENT TEMERATURE (°C) TJ MAX = 150°C MSOP θJA = 135°C/W SOIC θJA = 121°C/W Figure 3. Maximum Power Dissipation vs. Ambient Temperature SHORT-CIRCUIT CURRENT The AD8278 and AD8279 have built-in, short-circuit protection that limits the output current (see Figure 29 for more information). While the short-circuit condition itself does not damage the part, the heat generated by the condition can cause the part to exceed its maximum junction temperature, with corresponding negative effects on reliability. Figure 3 and Figure 29, combined with knowledge of the supply voltages and ambient temperature of the part, can be used to determine whether a short circuit will cause the part to exceed its maximum junction temperature. ESD CAUTION |
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