Vishay Siliconix

Si8429DB

Document Number: 74399

S13-1847-Rev.D, 19-Aug-13

www.vishay.com

7

This document is subject to change without notice.

PACKAGE OUTLINE

MICRO FOOT: 4-BUMP (0.8 mm PITCH)

Notes (unless otherwise specified):

1. Laser mark on the silicon die back, coated with a thin metal.

2. Bumps are Sn/Ag/Cu.

3. Non-solder mask defined copper landing pad.

4. The flat side of wafers is oriented at the bottom.

Notes:

a. Use millimeters as the primary measurement

Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon

Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and

Bump Note 2

8429

XXX

Recommended Land

Mark on Backside of Die

Silicon

b Diamerter

e

e

A

e

S

D

e

S

E

4 x

φ0.30

0.31

Note 3

Solder Mask

φ 0.40

Dim.

Inches

Min.

Max.

Min.

Max.

A

0.600

0.650

0.0236

0.0256

0.260

0.290

0.0102

0.0114

0.340

0.360

0.0134

0.0142

b

0.370

0.410

0.0146

0.0161

D

1.520

1.600

0.0598

0.0630

E

1.520

1.600

0.0598

0.0630

e

0.800

0.0315

S

0.360

0.400

0.0142

0.0157