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ADV7282WBCPZ Datasheet(PDF) 10 Page - Analog Devices |
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ADV7282WBCPZ Datasheet(HTML) 10 Page - Analog Devices |
10 / 32 page ADV7282 Data Sheet Rev. A | Page 10 of 32 ABSOLUTE MAXIMUM RATINGS Table 7. Parameter Rating AVDD to DGND 2.2 V DVDD to DGND 2.2 V PVDD to DGND 2.2 V MVDD to DGND1 2.2 V DVDDIO to DGND 4 V PVDD to DVDD −0.9 V to +0.9 V MVDD to DVDD1 −0.9 V to +0.9 V AVDD to DVDD −0.9 V to +0.9 V Digital Inputs Voltage DGND − 0.3 V to DVDDIO + 0.3 V Digital Outputs Voltage DGND − 0.3 V to DVDDIO + 0.3 V Analog Inputs to Ground Ground − 0.3 V to AVDD + 0.3 V Maximum Junction Temperature (TJ max) 140°C Storage Temperature Range −65°C to +150°C Infrared Reflow Soldering (20 sec) 260°C 1 MVDD applies to the ADV7282-M only. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. This device is a high performance integrated circuit with an ESD rating of <2 kV, and it is ESD sensitive. Proper precautions must be taken for handling and assembly. THERMAL RESISTANCE The thermal resistance values in Table 8 are specified for the device soldered onto a 4-layer printed circuit board (PCB) with a common ground plane and with the exposed pad of the device connected to DGND. The values in Table 8 are maximum values. Table 8. Thermal Resistance for the 32-Lead LFCSP Thermal Characteristic Symbol Value Unit Junction-to-Ambient Thermal Resistance (Still Air) θJA 32.5 °C/W Junction-to-Case Thermal Resistance θJC 2.3 °C/W REFLOW SOLDER The ADV7282/ADV7282-M is a Pb-free, environmentally friendly product. It is manufactured using the most up-to-date materials and processes. The coating on the leads of each device is 100% pure Sn electroplate. The device is suitable for Pb-free applications and can withstand surface-mount soldering at up to 255°C (±5°C). In addition, the ADV7282/ADV7282-M is backward- compatible with conventional SnPb soldering processes. This means that the electroplated Sn coating can be soldered with Sn/Pb solder pastes at conventional reflow temperatures of 220°C to 235°C. ESD CAUTION |
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