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AD8079ARZ Datasheet(PDF) 3 Page - Analog Devices |
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AD8079ARZ Datasheet(HTML) 3 Page - Analog Devices |
3 / 12 page 9 REV. A AD8079 –3– ABSOLUTE MAXIMUM RATINGS 1 Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.6 V Internal Power Dissipation 2 Small Outline Package (R) . . . . . . . . . . . . . . . . . . 0.9 Watts Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±V S Output Short Circuit Duration . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves Storage Temperature Range . . . . . . . . . . . . . –65 °C to +125°C Operating Temperature Range (A Grade) . . . – 40 °C to +85°C Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300 °C NOTES 1Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2Specification is for device in free air: 8-Pin SOIC Package: θ JA = 160°C/Watt MAXIMUM POWER DISSIPATION The maximum power that can be safely dissipated by the AD8079 is limited by the associated rise in junction tempera- ture. The maximum safe junction temperature for plastic encapsulated devices is determined by the glass transition tem- perature of the plastic, approximately +150 °C. Exceeding this limit temporarily may cause a shift in parametric performance due to a change in the stresses exerted on the die by the package. Exceeding a junction temperature of +175 °C for an extended period can result in device failure. While the AD8079 is internally short circuit protected, this may not be sufficient to guarantee that the maximum junction temperature (+150 °C) is not exceeded under all conditions. To ensure proper operation, it is necessary to observe the maximum power derating curves. AMBIENT TEMPERATURE – °C 2.0 1.5 0 –50 90 –40 –30 –20 –10 0 10 20 30 40 50 60 70 1.0 0.5 80 TJ = +150°C 8-PIN SOIC PACKAGE Figure 2. Plot of Maximum Power Dissipation vs. Temperature CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD8079 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. WARNING! ESD SENSITIVE DEVICE ORDERING GUIDE Temperature Package Package Model Gain Range Description Option AD8079AR G = +2.0 –40 °C to +85°C 8-Pin Plastic SOIC SO-8 AD8079AR-REEL G = +2.0 –40 °C to +85°C REEL SOIC SO-8 AD8079AR-REEL7 G = +2.0 –40 °C to +85°C REEL 7 SOIC SO-8 AD8079BR G = +2.2 –40 °C to +85°C 8-Pin Plastic SOIC SO-8 AD8079BR-REEL G = +2.2 –40 °C to +85°C REEL SOIC SO-8 AD8079BR-REEL7 G = +2.2 –40 °C to +85°C REEL 7 SOIC SO-8 |
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