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TPS24750RUVT Datasheet(PDF) 2 Page - Texas Instruments

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No. de pieza TPS24750RUVT
Descripción Electrónicos  12A eFuse Circuit Protector with Current Monitor
Download  42 Pages
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
Logo TI1 - Texas Instruments

TPS24750RUVT Datasheet(HTML) 2 Page - Texas Instruments

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TPS24750
TPS24751
SLVSC87 – OCTOBER 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
For the most current package and ordering information, see the Package Option Addendum at the end of this
document, or see the TI Web site at www.ti.com
PRODUCT INFORMATION
Operating Voltage
Part Number
Function
Fault Response
Status
Range
TPS24750RUV
2.5V - 18V
Integrated Hot Swap Protector
Latch
Active
TPS24751RUV
2.5V - 18V
Integrated Hot Swap Protector
Auto Retry
Active
Integrated Hot Swap Protector with FET
TPS24752RUV
2.5V - 18V
Latch
Preview
short indication
Integrated Hot Swap Protector with FET
TPS24753RUV
2.5V - 18V
Auto Retry
Preview
short indication
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range, all voltages referred to GND (unless otherwise noted)
MIN
MAX
UNIT
DRAIN, EN, FLTb(1), GATE, OUT, PGb(1), SENSE, SET(1), VCC
–0.3
30
OV
–0.3
20
Input voltage range
PROG(1)
–0.3
3.6
V
[SET, SENSE] to VCC
–0.3
0.3
IMON, TIMER
–0.3
5
Sink current
FLTb, PGb
5
mA
PROG
Internally limited
Source current
IMON
5
mA
All pins except PGb
2
Human-body model
ESD rating
PGb
0.5
kV
Charged-device model
0.5
Temperature
Maximum junction, TJ
150
°C
(1)
Do not apply voltage directly to these pins.
THERMAL INFORMATION
THERMAL METRIC(1)
RUV (36) PINS
UNIT
θJA
Junction-to-ambient thermal resistance
33.7
°C/W
θJCtop
Junction-to-case (top) thermal resistance
28.2
°C/W
θJB
Junction-to-board thermal resistance
5.8
°C/W
ψJT
Junction-to-top characterization parameter
0.3
°C/W
ψJB
Junction-to-board characterization parameter
5.7
°C/W
θJCbot
Junction-to-case (bottom) thermal resistance
1.1
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953b.
2
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Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: TPS24750 TPS24751


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