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HFC0300 Datasheet(PDF) 3 Page - Monolithic Power Systems

No. de Pieza. HFC0300
Descripción  Variable Off Time Controller
Descarga  21 Pages
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Fabricante  MPS [Monolithic Power Systems]
Página de inicio  http://www.monolithicpower.com
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HFC0300 Datasheet(HTML) 3 Page - Monolithic Power Systems

 
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HFC0300– VARIABLE OFF TIME CONTROLLER
HFC0300 Rev. 1.0
www.MonolithicPower.com
3
9/23/2011
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2011 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number*
Package
Top Marking
Free Air Temperature (TA)
HFC0300HS
SOIC-7
HFC0300
-40°C to +125°C
For Tape & Reel, add suffix –Z (e.g. HFC0300HS–Z);
For RoHS compliant packaging, add suffix –LF (e.g. HFC0300HS–LF–Z)
PACKAGE REFERENCE
ABSOLUTE MAXIMUM RATINGS (1)
HV Breakdown Voltage.............. -0.7V to +700V
VCC, DRV to GND........................-0.3V to +30V
DRV to GND .................................-0.3V to +18V
FSET, COMP, CS to GND ..............-0.3V to +7V
Continuous Power Dissipation (TA = +25°C)
(2)
SOIC-7……………………………………....1.3W
Junction Temperature...............................150°C
Thermal Shut Down ..................................150°C
Thermal Shut Down Hysteresis ..................25°C
Lead Temperature ....................................260°C
Storage Temperature .............. -60°C to +150°C
ESD Capability Human Body Model (All Pins
except Drain) ........................................... 2.0kV
ESD Capability Machine Model ................. 200V
Recommended Operation Conditions (3)
Maximum Junction Temp. (TJ) ............... +125°C
Operating Vcc range........................8.2V to 20V
Thermal Resistance
(4)
θJA
θJC
SOIC-7 ....................................96 ...... 45 ... °C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-to-
ambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX)-TA)/θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.
DRV
CS
GND
COPM
HV
VCC
FSET
1
2
3
4
8
6
5
TOP VIEW
SOIC-7


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