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LMP2021MFX Datasheet(PDF) 2 Page - Texas Instruments

No. de pieza LMP2021MFX
Descripción Electrónicos  LMP2021/LMP2022 Zero Drift, Low Noise, EMI Hardened Amplifiers
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Fabricante Electrónico  TI [Texas Instruments]
Página de inicio  http://www.ti.com
Logo TI - Texas Instruments

LMP2021MFX Datasheet(HTML) 2 Page - Texas Instruments

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background image
-
+
1/2
LMP2022
0.1 PF
-
+
1/2
LMP2022
0.1 PF
5.1 k:
0.1%
5.1 k:
0.1%
200:
200:
280:
VA
VA
+
-
VA
LMP2021
ADC161S626
+
VR = 1/2 VA
-
1 k:
1 k:
R3
R4
R1
R2
VA
EMI
180:
470 pF
VA = 5V
LMP2021, LMP2022
SNOSAY9E – SEPTEMBER 2008 – REVISED MARGH 2013
www.ti.com
TYPICAL APPLICATION
Figure 1. Bridge Amplifier
The LMP2021/LMP2022 support systems with up to 24 bits of accuracy.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1) (2)
ESD Tolerance(3)
Human Body Model
2000V
Machine Model
200V
Charge Device Model
1000V
VIN Differential
±VS
Supply Voltage (VS = V
+ – V)
6.0V
All Other Pins
V+ + 0.3V, V
− 0.3V
Output Short-Circuit Duration to V+ or V−(4)
5s
Storage Temperature Range
−65°C to 150°C
Junction Temperature(5)
150°C max
Soldering Information
Infrared or Convection (20 sec)
235°C
Wave Soldering Lead Temperature (10 sec)
260°C
(1)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2)
If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3)
Human Body Model per MIL-STD-883, Method 3015.7. Machine Model, per JESD22-A115-A. Field-Induced Charge-Device Model, per
JESD22-C101-C.
(4)
Package power dissipation should be observed.
(5)
The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(MAX) - TA)/ θJA. All numbers apply for packages soldered directly onto a PC board.
2
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Copyright © 2008–2013, Texas Instruments Incorporated
Product Folder Links: LMP2021 LMP2022


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