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LM61BIZ Datasheet(PDF) 7 Page - Texas Instruments |
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LM61BIZ Datasheet(HTML) 7 Page - Texas Instruments |
7 / 18 page LM61 www.ti.com SNIS121I – JUNE 1999 – REVISED FEBRUARY 2013 APPLICATION INFORMATION Mounting The LM61 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface. The temperature that the LM61 is sensing will be within about +0.2°C of the surface temperature that LM61's leads are attached to. This presumes that the ambient air temperature is almost the same as the surface temperature; if the air temperature were much higher or lower than the surface temperature, the actual temperature measured would be at an intermediate temperature between the surface temperature and the air temperature. To ensure good thermal conductivity the backside of the LM61 die is directly attached to the GND pin. The lands and traces to the LM61 will, of course, be part of the printed circuit board, which is the object whose temperature is being measured. Alternatively, the LM61 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LM61 and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy paints or dips are often used to ensure that moisture cannot corrode the LM61 or its connections. The thermal resistance junction to ambient ( θJA) is the parameter used to calculate the rise of a device junction temperature due to its power dissipation. For the LM61, Equation 1 is used to calculate the rise in the die temperature. TJ = TA + θJA [(+VS IQ) + (+VS − VO) IL] where • IQ is the quiescent current • ILis the load current on the output (1) Since the LM61's junction temperature is the actual temperature being measured care should be taken to minimize the load current that the LM61 is required to drive. Table 3 summarizes the rise in die temperature of the LM61 without any loading with a 3.3V supply, and the thermal resistance for different conditions. Table 3. Temperature Rise of LM61 Due to Self-Heating and Thermal Resistance ( θJA) SOT-23(1) SOT-23(2) TO-92(1) TO-92(3) NO HEAT SINK SMALL HEAT FIN NO HEAT SINK SMALL HEAT FIN θJA TJ − TA θJA TJ − TA θJA TJ − TA θJA TJ − TA (°C/W) (°C) (°C/W) (°C) (°C/W) (°C) (°C/W) (°C) Still air 450 0.26 260 0.13 180 0.09 140 0.07 Moving air 180 0.09 90 0.05 70 0.03 (1) Part soldered to 30 gauge wire. (2) Heat sink used is ½ ″ square printed circuit board with 2 oz. foil with part attached as shown in Figure 14. (3) Part glued and leads soldered to 1" square of 1/16" printed circuit board with 2oz. foil or similar. Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Links: LM61 |
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