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CSD17483F4 Datasheet(PDF) 2 Page - Texas Instruments |
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CSD17483F4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 12 page CSD17483F4 SLPS447B – JULY 2013 – REVISED FEBRUARY 2014 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 4 Specifications 4.1 Electrical Characteristics (TA = 25°C unless otherwise stated) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Static Characteristics BVDSS Drain-to-Source Voltage VGS = 0 V, IDS = 250 μA 30 V IDSS Drain-to-Source Leakage Current VGS = 0 V, VDS = 9.6 V 100 nA IGSS Gate-to-Source Leakage Current VDS = 0 V, VGS = 4 V 50 nA VGS(th) Gate-to-Source Threshold Voltage VDS = VGS, IDS = 250 μA 0.65 0.85 1.10 V VGS = 1.8 V, IDS =0.5 A 370 550 m Ω VGS = 2.5 V, IDS =0.5 A 240 310 m Ω RDS(on) Drain-to-Source On Resistance VGS = 4.5 V, IDS = 0.5 A 200 260 m Ω VGS = 8 V, IDS =0.5 A 185 240 m Ω gfs Transconductance VDS = 15 V, IDS = 0.5 A 2.4 S Dynamic Characteristics Ciss Input Capacitance 145 190 pF VGS = 0 V, VDS = 15 V, Coss Output Capacitance 42 55 pF f = 1 MHz Crss Reverse Transfer Capacitance 2 3 pF RG Series Gate Resistance 23 Ω Qg Gate Charge Total (4.5 V) 1010 1300 pC Qgd Gate Charge Gate to Drain 130 pC VDS = 15 V, IDS = 0.5 A Qgs Gate Charge Gate to Source 220 pC Qg(th) Gate Charge at Vth 145 pC Qoss Output Charge VDS = 15 V, VGS = 0 V 1095 pC td(on) Turn On Delay Time 3.3 ns tr Rise Time 1.3 ns VDS = 0 V, VGS = 4.5 V, IDS = 0.5 A,RG = 2 Ω td(off) Turn Off Delay Time 10.6 ns tf Fall Time 3.4 ns Diode Characteristics VSD Diode Forward Voltage ISD = 0.5 A, VGS = 0 V 0.73 0.9 V Qrr Reverse Recovery Charge 1475 pC VDS= 15 V, IF = 0.5 A, di/dt = 300 A/μs trr Reverse Recovery Time 5.5 ns 4.2 Thermal Characteristics (TA = 25°C unless otherwise stated) PARAMETER Typical Values UNIT Junction-to-Ambient Thermal Resistance(1) 90 °C/W RθJA Junction-to-Ambient Thermal Resistance(2) 250 °C/W (1) Device mounted on FR4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu. (2) Device mounted on FR4 material with minimum Cu mounting area. 2 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated Product Folder Links: CSD17483F4 |
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