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ADS7841E Datasheet(PDF) 4 Page - Burr-Brown (TI) |
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ADS7841E Datasheet(HTML) 4 Page - Burr-Brown (TI) |
4 / 14 page ® 4 ADS7841 PIN CONFIGURATIONS Top View MINIMUM RELATIVE DIFFERENTIAL SPECIFICATION PACKAGE ACCURACY NONLINEARITY TEMPERATURE DRAWING ORDERING TRANSPORT PRODUCT (LSB) (LSB) RANGE PACKAGE NUMBER(1) NUMBER(2) MEDIA ADS7841E ±2 68 –40 °C to +85°C 16-Lead SSOP 322 ADS7841E Rails " " " " " " ADS7841E/2K5 Tape and Reel ADS7841P ±2 68 –40 °C to +85°C 16-Pin PDIP 180 ADS7841P Rails ADS7841EB ±1 70 –40 °C to +85°C 16-Lead SSOP 322 ADS7841EB Rails " " " " " " ADS7841EB/2K5 Tape and Reel ADS7841PB ±1 70 –40 °C to +85°C 16-Pin PDIP 180 ADS7841PB Rails NOTES: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. (2) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 2500 pieces of “ADS7841/2K5” will get a single 2500-piece Tape and Reel. For detailed Tape and Reel mechanical information, refer to Appendix B of Burr-Brown IC Data Book. PACKAGE/ORDERING INFORMATION 1 2 3 4 5 6 7 8 +V CC CH0 CH1 CH2 CH3 COM SHDN V REF DCLK CS DIN BUSY DOUT MODE GND +V CC 16 15 14 13 12 11 10 9 ADS7841 1 2 3 4 5 6 7 8 +V CC CH0 CH1 CH2 CH3 COM SHDN V REF DCLK CS DIN BUSY DOUT MODE GND +V CC 16 15 14 13 12 11 10 9 ADS7841 DIP SSOP PIN DESCRIPTIONS PIN NAME DESCRIPTION 1+VCC Power Supply, 2.7V to 5V. 2 CH0 Analog Input Channel 0. 3 CH1 Analog Input Channel 1. 4 CH2 Analog Input Channel 2. 5 CH3 Analog Input Channel 3. 6 COM Ground Reference for Analog Inputs. Sets zero code voltage in single-ended mode. Connect this pin to ground or ground reference point. 7 SHDN Shutdown. When LOW, the device enters a very low power shutdown mode. 8VREF Voltage Reference Input 9+VCC Power Supply, 2.7V to 5V. 10 GND Ground 11 MODE Conversion Mode. When LOW, the device always performs a 12-bit conversion. When HIGH, the resolution is set by the MODE bit in the CONTROL byte. 12 DOUT Serial Data Output. Data is shifted on the falling edge of DCLK. This output is high impedance when CS is HIGH. 13 BUSY Busy Output. This output is high impedance when CS is HIGH. 14 DIN Serial Data Input. If CS is LOW, data is latched on rising edge of DCLK. 15 CS Chip Select Input. Controls conversion timing and enables the serial input/output register. 16 DCLK External Clock Input. This clock runs the SAR conversion process and synchronizes serial data I/O. ABSOLUTE MAXIMUM RATINGS(1) +VCC to GND ......................................................................... –0.3V to +6V Analog Inputs to GND ............................................ –0.3V to +VCC + 0.3V Digital Inputs to GND ........................................................... –0.3V to +6V Power Dissipation .......................................................................... 250mW Maximum Junction Temperature ................................................... +150 °C Operating Temperature Range ....................................... –40 °C to +85°C Storage Temperature Range ......................................... –65 °C to +150°C Lead Temperature (soldering, 10s) ............................................... +300 °C NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifi- cations. |
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