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SODJ11ASH Datasheet(PDF) 6 Page - Leshan Radio Company |
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SODJ11ASH Datasheet(HTML) 6 Page - Leshan Radio Company |
6 / 8 page Reel packing 5.Suggested thermal profile for soldering process 1. Storage environment:Temperature=5~40℃ Humidity=55±25% 2. Reflow soldering of surface-mount device 3. Reflow soldering SODJ***(C)A-SH SOD123-FL 7" 3,000 4.0 30,000 183*183*123 178 382*262*387 240,000 8.7 BOX (pcs) INNER BOX (mm) REEL DIA. (mm) CARTON SIZE (mm) CARTON (PCS) APPOX. GROSS WEIGHT (kg) PACKAGE REEL SIZE REEL (PCS) COMPONENT SPACING (mm) Profile Feature Soldering Condition 10~30sec Average ramp-up rate(TL to TP) <3℃/sec Preheat - Temperature Min(Tsmin) - Temperature Max(Tsmax) - Time(min to max)(ts) 150℃ 200℃ 60~120sec Tsmax to TL - Ramp-up Rate <3sec Ramp-down Rate <6℃/sec Time 25℃ to Peak Temperature <6minutes Time maintained above: - Temperature (TL) - Time(tL) 217℃ 60-260sec Peak Temperature(TP) 255 -0/+5℃ Time within 5℃ of actual Peak Temperature(TP) |
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