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Data Sheet

SML-D14(A) series

lAttention Points In Handling

This product was developed as a surface mount LED especially suitable for reflow soldering.

Please take care of following points when using this device.

1.DESIGNING OF PCB

As for a recommendable solder pattern, Please refer to Fig-1.

The size and direction of the pad pattern depend on the condition of the PCB.

Thorough design review is recommended before the final designing

This product of structured with rear/bottom electrode to be soldered.

The formation of solder fillet is not guaranteed due to its electrode shape.

2.SOLDERING (Sn-Cu, Sn-Ag-Cu, Sn-Ag-Bi-Cu)

LED products do not contain reinforcement

materials such as glass fillers.

Therefore, thermal stress by soldering greatly

influence its reliability.

The temperature conditions for reflow soldering

should therefore be set up according to the

characteristic of this product. (See Fig-2)

Number of reflow process shall be max 2 times

and these processes shall be performed in a row.

Cooling process to normal temperature shall be required

between first and second soldering process.

3.HANDLING AFTER MOUNTING (Fig-3)

As shown in the drawing on the right, in case outside force of

about 700g is given to the device, stress is concentrated to the

jointed part between mold resin and substrate.

Therefore there is a possibility to breath the device or PCB.

Careful handing is needed as ROHM cannot guarantee

the falling of the device by outside force after mounting.

Min.1 min Max. 40sec

Max.260ºC, Within 10sec

140 to 180ºC

230 to 260ºC

(Fig-3)

(Fig-2)

0.85mm

0.8mm

0.8mm

PCB Bonding Direction

0.8mm

(Fig-1)

Outside Force

PCB

Mold

Substrate

Soldering part

Emitting Direction

6/7

2014.01 - Rev.A