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LMV358MM Datasheet(PDF) 2 Page - National Semiconductor (TI) |
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LMV358MM Datasheet(HTML) 2 Page - National Semiconductor (TI) |
2 / 45 page LMV321-N, LMV321-N-Q1, LMV358-N, LMV358-N-Q1 LMV324-N, LMV324-N-Q1 SNOS012I – AUGUST 2000 – REVISED FEBRUARY 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) ESD Tolerance (3) Human Body Model LMV358-N/LMV324-N 2000V LMV321-N 900V Machine Model 100V Differential Input Voltage ±Supply Voltage Input Voltage −0.3V to +Supply Voltage Supply Voltage (V+–V −) 5.5V Output Short Circuit to V + (4) Output Short Circuit to V − (5) Soldering Information Infrared or Convection (30 sec) 260°C Storage Temp. Range −65°C to 150°C Junction Temperature (6) 150°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for availability and specifications. (3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC (4) Shorting output to V+ will adversely affect reliability. (5) Shorting output to V-will adversely affect reliability. (6) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board. Operating Ratings (1) Supply Voltage 2.7V to 5.5V Temperature Range (2) LMV321-N/LMV358-N/LMV324-N −40°C to +125°C Thermal Resistance ( θ JA) (3) 5-pin SC70 478°C/W 5-pin SOT23 265°C/W 8-Pin SOIC 190°C/W 8-Pin MSOP 235°C/W 14-Pin SOIC 145°C/W 14-Pin TSSOP 155°C/W (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics. (2) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board. (3) All numbers are typical, and apply for packages soldered directly onto a PC board in still air. 2 Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated Product Folder Links: LMV321-N LMV321-N-Q1 LMV358-N LMV358-N-Q1 LMV324-N LMV324-N-Q1 |
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