www.rohm.com

© 2013 ROHM Co., Ltd. All rights reserved.

Data Sheet

SML-81 series

lAttention Points In Handling

This product was developed as a surface mount LED especially suitable for soldering.

Please take care of following points when using this device.

1.DESIGNING OF PCB

As for a recommendable solder pattern, Please refer to Fig-1.

The size and direction of the pad pattern depends on the condition of the PCB,

Thorough design review is recommended before the final designing.

This product of structured with rear/bottom electrode to be soldered.

The formation of solder fillet is not guaranteed due to its electrode shape

2.SOLDERING (Sn-Cu, Sn-Ag-Cu, Sn-Ag-Bi-Cu)

LED products do not contain reinforcement

materials such as glass fillers.

Therefore, thermal stress by soldering greatly

influence its reliability.

The temperature conditions for reflow soldering

should therefore be set up according to the

characteristic of this product. (See Fig-2)

Number of reflow process shall be max 2 times

and these processes shall be performed in a row.

Cooling process to normal temperature shall be required

between first and second soldering process.

3.WASHING

Please note the following points when washing is required after soldering.

3-1) WASHING SOLVENT

Isopropyl alcohol or other alcohol solvent is recommendable.

3-2) TEMPERATURE

Below 30ºC, immersion time ; within 3 minutes.

3-3) ULTRA SONIC WASHING

Below 15/1 litter of solvent tub.

3-4) COOLING

Below 100ºC within 3 minutes.

4.EROSION GAS

Utilization in erosion gas atmosphere may degenerate the plating surface which might cause deterioration of

solder strength, optical characteristics, or functions.

Please take precautions against occurrence of gas from the surrounding parts on the occasion of custody,

and also after mounted on circuit board.

Min.1 min Max. 40sec

Max.260ºC, Within 10sec

140 to 180ºC

230 to 260ºC

(Fig-1)

(Fig-2)

Hole

4.2

1.25

f

2.4

(unit : mm)

9/10

2013.10 - Rev.E