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LMR10510 Datasheet(PDF) 4 Page - Texas Instruments |
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LMR10510 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 26 page LMR10510 SNVS727A – OCTOBER 2011 – REVISED OCTOBER 2011 www.ti.com Electrical Characteristics (1) (2) VIN = 5V unless otherwise indicated under the Conditions column. Limits in standard type are for TJ = 25°C only; limits in boldface type apply over the junction temperature (TJ) range of -40°C to +125°C. Minimum and Maximum limits are specified through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Symbol Parameter Conditions Min Typ Max Units VFB Feedback Voltage 0.588 0.600 0.612 V ΔVFB/VIN Feedback Voltage Line Regulation VIN = 3V to 5V 0.02 %/V IB Feedback Input Bias Current 0.1 100 nA VIN Rising 2.73 2.90 V Undervoltage Lockout UVLO VIN Falling 1.85 2.3 UVLO Hysteresis 0.43 V LMR10510-X 1.2 1.6 1.95 FSW Switching Frequency MHz LMR10510-Y 2.25 3.0 3.75 LMR10510-X 86 94 DMAX Maximum Duty Cycle % LMR10510-Y 82 90 LMR10510-X 5 DMIN Minimum Duty Cycle % LMR10510-Y 7 WSON Package 150 RDS(ON) Switch On Resistance m Ω SOT-23 Package 130 195 ICL Switch Current Limit VIN = 3.3V 1.2 1.75 A Shutdown Threshold Voltage 0.4 VEN_TH V Enable Threshold Voltage 1.8 ISW Switch Leakage 100 nA IEN Enable Pin Current Sink/Source 100 nA LMR10510X VFB = 0.55 3.3 5 mA Quiescent Current (switching) IQ LMR10510Y VFB = 0.55 4.3 6.5 mA Quiescent Current (shutdown) All Options VEN = 0V 30 nA WSON Package 80 Junction to Ambient θJA °C/W 0 LFPM Air Flow(3) SOT-23 Package 118 WSON Package 18 θJC Junction to Case °C/W SOT-23 Package 80 TSD Thermal Shutdown Temperature 165 °C (1) Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation using Statistical Quality Control (SQC) methods. Limits are used to calculate TI’s Average Outgoing Quality Level (AOQL). (2) Typical numbers are at 25°C and represent the most likely parametric norm. (3) Applies for packages soldered directly onto a 3” x 3” PC board with 2oz. copper on 4 layers in still air. 4 Submit Documentation Feedback Copyright © 2011, Texas Instruments Incorporated Product Folder Links: LMR10510 |
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