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TSC2017 Datasheet(PDF) 2 Page - Texas Instruments |
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TSC2017 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 39 page TSC2017 SBAS472 – DECEMBER 2009 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) TYPICAL TYPICAL NO MISSING INTEGRAL GAIN CODES SPECIFIED TRANSPORT LINEARITY ERROR RESOLUTION PACKAGE PACKAGE TEMPERATURE PACKAGE ORDERING MEDIA, PRODUCT (LSB) (LSB) (BITS) TYPE DESIGNATOR RANGE MARKING NUMBER QUANTITY Small Tape TSC2017IYZGT 12-Pin, and Reel, 250 TSC2017I ±1.5 0.1 11 3 x 4 Array, YZG –40°C to +85°C TSC2017I Tape and WCSP TSC2017IYZGR Reel, 3000 (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or see the TI website at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range, unless otherwise noted. TSC2017 UNIT Analog input X+, Y+, AUX to GND –0.4 to VDD + 0.1 V Voltage range Analog input X–, Y– to GND –0.4 to VDD + 0.1 V VDD/REF pin to GND –0.3 to +5 V Digital input voltage to GND –0.3 to VDD + 0.3 V Digital output voltage to GND –0.3 to VDD + 0.3 V Power dissipation (TJ Max - TA)/θJA Low-K 113 Thermal impedance, θJA WCSP package °C/W High-K 62 Operating free-air temperature range, TA –40 to +85 °C Storage temperature range, TSTG –65 to +150 °C Junction temperature, TJ Max +150 °C IEC contact discharge(2) X+, X–, Y+, Y– ±15 kV IEC air discharge(2) X+, X–, Y+, Y– ±25 kV (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute-maximum rated conditions for extended periods may affect device reliability. (2) Test method based on IEC standard 61000-4-2. Contact Texas Instruments for test details. 2 Submit Documentation Feedback Copyright © 2009, Texas Instruments Incorporated Product Folder Link(s): TSC2017 |
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