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LM3153 Datasheet(PDF) 3 Page - Texas Instruments |
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LM3153 Datasheet(HTML) 3 Page - Texas Instruments |
3 / 27 page LM3151, LM3152, LM3153 www.ti.com SNVS562G – SEPTEMBER 2008 – REVISED MARCH 2011 PIN DESCRIPTIONS Pin Name Description Function Supply Voltage for Nominally regulated to 5.95V. Connect a 1 µF to 2.2 µF decoupling capacitor from this pin to 1 VCC FET Drivers ground. Supply pin to the device. Nominal input range is 6V to 42V. See ordering information for Vin 2 VIN Input Supply Voltage limitations. To enable the IC apply a logic high signal to this pin greater than 1.26V typical or leave 3 EN Enable floating. To disable the part, ground the EN pin. Internally connected to the resistor divider network which sets the fixed output voltage. This 4 FB Feedback pin also senses the output voltage faults such a over-voltage and short circuit conditions. Ground for all internal bias and reference circuitry. Should be connected to PGND at a single 5,9 SGND Signal Ground point. An internal 7.7 µA current source charges an external capacitor to provide the soft-start 6 SS Soft-Start function. Internally not electrically connected. These pins may be left unconnected or connected to 7,8 N/C Not Connected ground. Switch pin of controller and high-gate driver lower supply rail. A boost capacitor is also 10 SW Switch Node connected between this pin and BST pin Gate drive signal to the high-side NMOS switch. The high-side gate driver voltage is supplied 11 HG High-Side Gate Drive by the differential voltage between the BST pin and SW pin. High-gate driver upper supply rail. Connect a 0.33 µF-0.47 µF capacitor from SW pin to this Connection for 12 BST pin. An internal diode charges the capacitor during the high-side switch off-time. Do not Bootstrap Capacitor connect to an external supply rail. Gate drive signal to the low-side NMOS switch. The low-side gate driver voltage is supplied by 13 LG Low-Side Gate Drive VCC. Synchronous rectifier MOSFET source connection. Tie to power ground plane. Should be tied 14 PGND Power Ground to SGND at a single point. Exposed die attach pad should be connected directly to SGND. Also used to help dissipate EP EP Exposed Pad heat out of the IC. Copyright © 2008–2011, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM3151 LM3152 LM3153 |
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