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LM2831 Datasheet(PDF) 2 Page - Texas Instruments |
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LM2831 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 34 page 1 2 3 4 6 5 EN FB SW DAP VINA VIND GND VIN SW 2 1 3 5 4 EN FB GND LM2831 SNVS422B – AUGUST 2006 – REVISED JANUARY 2012 www.ti.com Connection Diagrams Figure 1. 6-Pin WSON Figure 2. 5-Pin SOT-23 See Package Number NGG See Package Number DBV PIN DESCRIPTIONS (5-PIN SOT-23) Pin Name Function 1 SW Output switch. Connect to the inductor and catch diode. 2 GND Signal and power ground pin. Place the bottom resistor of the feedback network as close as possible to this pin. 3 FB Feedback pin. Connect to external resistor divider to set output voltage. 4 EN Enable control input. Logic high enables operation. Do not allow this pin to float or be greater than VIN + 0.3V. 5 VIN Input supply voltage. PIN DESCRIPTIONS (6-PIN WSON) Pin Name Function 1 FB Feedback pin. Connect to external resistor divider to set output voltage. 2 GND Signal and power ground pin. Place the bottom resistor of the feedback network as close as possible to this pin. 3 SW Output switch. Connect to the inductor and catch diode. 4 VIND Power Input supply. 5 VINA Control circuitry supply voltage. Connect VINA to VIND on PC board. 6 EN Enable control input. Logic high enables operation. Do not allow this pin to float or be greater than VINA + 0.3V. DAP Die Attach Pad Connect to system ground for low thermal impedance, but it cannot be used as a primary GND connection. These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) VIN -0.5V to 7V FB Voltage -0.5V to 3V EN Voltage -0.5V to 7V SW Voltage -0.5V to 7V ESD Susceptibility 2kV Junction Temperature(3) 150°C Storage Temperature −65°C to +150°C Soldering Information Infrared or Convection Reflow (15 sec) 220°C (1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Range indicates conditions for which the device is intended to be functional, but does not ensure specific performance limits. For ensured specifications and test conditions, see the Electrical Characteristics. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) Thermal shutdown will occur if the junction temperature exceeds the maximum junction temperature of the device. 2 Submit Documentation Feedback Copyright © 2006–2012, Texas Instruments Incorporated Product Folder Links: LM2831 |
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