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TPS622317 Datasheet(PDF) 3 Page - Texas Instruments |
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TPS622317 Datasheet(HTML) 3 Page - Texas Instruments |
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3 / 36 page  TPS62230, TPS62231, TPS62232, TPS62233, TPS62234, TPS62235, TPS62236 TPS62237, TPS62238, TPS62239, TPS622310, TPS622311, TPS622312 TPS622313, TPS622314, TPS622315, TPS622316, TPS622317, TPS622318 www.ti.com SLVS941E – APRIL 2009 – REVISED DECEMBER 2010 DISSIPATION RATINGS (1) POWER RATING DERATING FACTOR PACKAGE RθJA FOR TA ≤ 25°C ABOVE TA = 25°C 1 × 1.5 SON 234°C/W(2) 420 mW 4.2 mW/°C (1) Maximum power dissipation is a function of TJ(max), θJA and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = [TJ(max) – TA] /θJA. (2) This thermal data is measured with high-K board (4 layers board according to JESD51-7 JEDEC standard). RECOMMENDED OPERATING CONDITIONS operating ambient temperature TA = –40 to 85°C (unless otherwise noted) (1) MIN NOM MAX UNIT Supply voltage VIN (2) 2.05 6 V Effective inductance 2.2 μH Effective capacitance 2.0 4.7 μF VOUT ≤ VIN -1 V (3) 500 mA maximum IOUT (4) 3.0 3.6 Recommended minimum 350mA maximum IOUT (5) 2.5 2.7 V supply voltage VOUT ≤ 1.8V 60 mA maximum output current(5) 2.05 Operating virtual junction temperature range, TJ –40 125 °C (1) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package in the application ( θJA), as given by the following equation: TA(max) = TJ(max) – (θJA × PD(max)). (2) The minimum required supply voltage for startup is 2.05 V. The part is functional down to the falling UVL (Under Voltage Lockout) threshold. (3) For a voltage difference between minimum VIN and VOUT of ≥ 1 V (4) Typical value applies for TA = 25°C, maximum value applies for TA = 70°C with TJ ≤ 125°C, PCB layout needs to support proper thermal performance. (5) Typical value applies for TA = 25°C, maximum value applies for TA = 85°C with TJ ≤ 125°C, PCB layout needs to support proper thermal performance. Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback 3 |
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