ADS8883

SBAS567A – MAY 2013 – REVISED DECEMBER 2013

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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

THROUGHPUT

18-BIT, TRUE-DIFFERENTIAL

16-BIT, SINGLE-ENDED

16-BIT, TRUE-DIFFERENTIAL

100 kSPS

ADS8887

ADS8866

ADS8867

250 kSPS

—

—

—

400 kSPS

ADS8885

ADS8864

ADS8865

500 kSPS

—

ADS8319(2)

ADS8318(2)

680 kSPS

ADS8883

ADS8862

ADS8863

1 MSPS

ADS8881

ADS8860

ADS8861

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the

device product folder at www.ti.com.

(2)

Pin-to-pin compatible device with AVDD = 5 V.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range, unless otherwise noted.

VALUE

MIN

MAX

UNIT

AINP to GND or AINN to GND

–0.3

REF + 0.3

V

AVDD to GND or DVDD to GND

–0.3

4

V

REF to GND

–0.3

5.7

V

Digital input voltage to GND

–0.3

DVDD + 0.3

V

Digital output to GND

–0.3

DVDD + 0.3

V

–40

+85

°C

–65

+150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under electrical characteristics is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

THERMAL INFORMATION

ADS8883

DGS

DRC

UNITS

10 PINS

10 PINS

Junction-to-ambient thermal resistance

151.9

111.1

Junction-to-case (top) thermal resistance

45.4

46.4

Junction-to-board thermal resistance

72.2

45.9

°C/W

Junction-to-top characterization parameter

3.3

3.5

Junction-to-board characterization parameter

70.9

45.5

Junction-to-case (bottom) thermal resistance

N/A

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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