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HCPL-7860 Datasheet(PDF) 11 Page - Agilent(Hewlett-Packard) |
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HCPL-7860 Datasheet(HTML) 11 Page - Agilent(Hewlett-Packard) |
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11 / 28 page  1-270 Figure 13. Dependence of Safety- Limiting Values on Temperature. Insulation and Safety Related Specifications Parameter Symbol Value Units Conditions Minimum External Air Gap L(I01) 7.4 mm Measured from input terminals to output (Clearance) terminals, shortest distance through air. Minimum External Tracking L(I02) 8.0 mm Measured from input terminals to output (Creepage) terminals, shortest distance path along body Minimum Internal Plastic Gap 0.5 mm Insulation thickness between emitter and (Internal Clearance) detector; also known as distance through insulation. Tracking Resistance CTI 175 Volts DIN IEC 112/VDE 0303 Part 1 (Comparative Tracking Index) Isolation Group IIIa Material Group (DIN VDE 0110, 1/89, Table 1) Option 300 - surface mount classification is Class A in accordance with CECC 00802. Absolute Maximum Ratings Parameter Symbol Min. Max. Units Note Storage Temperature TS -55 125 °C Ambient Operating Temperature TA -40 +85 °C Supply Voltages VDD1, VDD2 0 5.5 Volts Steady-State Input Voltage VIN+, VIN- -2.0 VDD1 + 0.5 Volts 16 Two Second Transient Input Voltage -6.0 Output Voltages MCLK, MDAT -0.5 VDD2 +0.5 Volts Lead Solder Temperature 260 °C for 10 sec., 1.6 mm below seating plane 17 Solder Reflow Temperature Profile See Maximum Solder Reflow Thermal Profile section Recommended Operating Conditions Parameter Symbol Min. Max. Units Note Ambient Operating Temperature TA -40 +85 °C Supply Voltages VDD1, VDD2 4.5 5.5 V Input Voltage VIN+, VIN- -200 +200 mV 16 TA – TEMPERATURE – °C 150 100 50 50 300 100 150 MAX. OPERATING TEMP. IS 100 °C 0 200 PSi, OUTPUT 250 0 200 PSi, INPUT |
Número de pieza similar - HCPL-7860 |
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Descripción similar - HCPL-7860 |
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